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Conductive Adhesives
GPC 251A/B is a two-part room temperature curing silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices.
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GPC 352-1A/B-187/119-44 is a two-part heat curing silver filled epoxy adhesive. Curative, 119-44 provides a longer pot life. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions. Applications include the following:
- Bonding surface mount components to rigid PC boards
- Attachment of electrical and electronic components
- Heat sink attachments
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118-06 is available in a pad-printable (PP), syringe dispensable (SD), screen-printable (SP), or stencible (ST) B-stageable electrically conductive epoxy die attach adhesive. Applications include, but are not limited to:
- Bonding capacitors to lead frames
- Die attachment
- Assembling electrical and electronic components
- Mounting devices to flexible and rigid circuitry
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Anisotropic Conductive Adhesives
121-20A/B is a two-component low temperature curing silver filled epoxy adhesive. Applications include, but are not limited to:
- Conductive splicing of ribbon cables
- Bonding of flex circuits to PC boards, E.L. panels, and touch panels
- Bonding of electrical components in applications where short circuits between closely spaced contact pads are a concern
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121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. Some applications for this material include, but are not limited to:
- Bonding of flex circuits to PC boards
- Electrical attachment of surface mounted devices
- Excellent adhesion to a variety of metallic contact pad compositions
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Underfill Materials (Dielectrics)
120-27A/B-187 is a black low viscosity two-component underfill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface.
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113-33A/B is a sag-resistant black glob top flame-out two-component epoxy potting and encapsulating compound. This material is crack resistant with a working life greater than thirty minutes.
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102-11A/B187 is a crack resistant black flameout epoxy compound. This material features a long pot life and excellent resistance to thermal shock. Some applications include, but are not limited to:
- Encapsulating
- Bonding of electronics
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102-12A/B-187 is a thermal-cycle resistant black epoxy compound with an excellent resistance to shock. This product requires mild heat cure and has a working life of greater than four hours.
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116-04A/B-187 is a low viscosity two-component underfill potting and encapsulating compound. This product is designed for applications requiring extremely good thermal conductivity.
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123-38A/B-187 is a low-viscosity two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity.
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