Flip Chip

Flip chip mounting is a form of die attachment in which the chip is inverted to bring the adhesive into direct contact with the circuit board, allowing for a much smaller chip assembly and a more direct and higher signal density. Electrically conductive adhesives can be used in flip chip assembly as solder replacement when temperature-sensitive components or carriers are used. In order to facilitate finer tolerances required in some flip chip assembly, Creative Materials has developed a wide variety of anisotropic conductive adhesives that can be applied using wafer backside coating or applied directly to the carrier. These anisotropic adhesives are needed in applications where short circuits between closely spaced pads are a concern. Underfill materials are specialty engineered epoxies that fill the area between the die and carrier, designed to control stress in adhesive points caused by differences in thermal expansion between the die and the carrier and to act as a heat bridge to keep the chip cool.

Flipchip Attachment

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Question
Product
Recommendation

Electrically Conductive Adhesives

Product
Description
Pot Life
Recommended Cure Schedules
GPC-251A/B Two-part room temperature curing silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices. 60 mins 24 hours @ room temp
5 mins @ 120°C
GPC-352-1A/B-187 Low Temperature, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions. 4 hours 90 mins @ 80°C
30 mins @ 125°C
15 mins @ 150°C
GPC-352-1A/B119-44 Long pot life, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions. 2 to 4 days 60 mins @ 100°C
30 mins @ 125°C
15 mins @ 150°C
118-06 (SD) Single component, syringe dispensable, B-stageable electrically conductive epoxy die attach adhesive. Other versions available for different application methods. 2 months 60 min @ 150°C
30 mins at 175°C

Anisotropic Conductive Adhesives

Product
Description
Pot Life
Recommended Cure Schedules
121-20A/B Two-component low temperature curing silver filled epoxy adhesive exhibiting conductive only in the z-axis. 2 to 4 days 90 mins @ 80°C
30 mins @ 125°C
15 mins @ 150°C
121-23 Single component, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. 2 months 60 min @ 150°C
30 mins at 175°C

Underfill Materials

Product
Description
Pot Life
Recommended Cure Schedules
120-27A/B-187 Black low viscosity two-component underfill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface. > 2 hours 20 hours @ 60°C
113-33A/B Sag-resistant black glob top flame-out two-component epoxy potting and encapsulating compound. This material is crack resistant with a working life greater than thirty minutes. > 4 hours 120 mins @ 80°C
30 mins @ 100°C
102-11A/B-187 Crack resistant black flameout epoxy compound. This material features a long pot life and excellent resistance to thermal shock. > 4 hours 120 mins @ 80°C
30 mins @ 100°C
102-12A/B-187 Thermal-cycle resistant black epoxy compound with an excellent resistance to shock. This product requires mild heat cure and has a working life of greater than four hours. > 4 hours 60 mins @ 80°C
30 mins @ 100°C
116-04A/B-187 Low viscosity two-component underfill potting and encapsulating compound. This product is designed for applications requiring extremely good thermal conductivity. > 4 hours 60 mins @ 80°C
30 mins @ 100°C
123-38A/B-187 Low-viscosity two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity. > 4 hours 60 mins @ 80°C
30 mins @ 100°C

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