Thermal Management

Thermal management has become increasingly important in modern electronics design as electronic components generate a significant amount of heat - CPUs, power diodes, power transistors are some examples, as is LED lighting.

The properties of 109-12 are ideal for most thermal management applications. This product has low viscosity, reducing air entrapment and allowing for minimal product application, which keeps thermal resistance low. 109-12 is one-component low-stress epoxy, with low shrinkage during curing, and exceptional resistance to thermal-cycling. Similar products are 108-50, 111-17 and 125-31C. Creative Materials' 122-07(SP) features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. The thermal cure cycle produces cross-linked, void free bonds. Another effective thermal management product is 122-39(SD), a syringe-dispensable, 100% solids, thermally conductive, electrically insulating, one-component, epoxy adhesive, featuring excellent thermal stability, outstanding chemical resistance and excellent high temperature properties.

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Question
Product
Recommendation

Product
Application Method
Description
Thermal Conductivity (W/mK)
109-12 Syringe dispense Thermally conductive, best for thermal mismatches and thermal cycling. 5.65
122-07 Screen-print B-stageable, high thermal conductivity adhesive. 5.5
122-07F Transfer film B-staged, thermally conductive adhesive film adhesive. 5.5
122-29 Syringe dispense Low stress, thermally conductive epoxy adhesive. 0.35
122-39(SD) Syringe dispense Thermally conductive die attach adhesive. 5.5
119-24 Screen-print B-stageable, low cost thermally conductive adhesive. 0.78
117-49 Pad print B-stageable, thermally conductive coating and adhesive. 0.52
125-31C Syringe dispense Long pot life, single component thermally conductive adhesive. 5.5

ISO 9001 ISO 14001 ROHS Reach