Syringe dispensable, one component silver filled electrically conductive adhesive.
Die Attachment
Electraset 620
Die Attach grade conductive epoxy/adhesive for high throughput applications
Die Attachment
Electraset 620-2
Die Attach grade conductive epoxy/adhesive with excellent thermal cycle properties
Die Attachment
Electraset 620-3
Die Attach grade conductive epoxy/adhesive with highest thermal conductivity
Die Attachment
Electraset 620-4
Die Attach grade conductive epoxy/adhesive with no bleed on gold contacts
Die Attachment
122-07(SP)
Screen-Printable, b-Stageable, thermally conductive epoxy adhesive. Excellent flexibility in B-staged form
Die Attachment
127-12
Die attach grade thermally conductive epoxy adhesive
Die Attachment
122-39(SD)
One component thermally conductive adhesive.
Die Attachment
127-15(SD)
Thermally conductive flexible die attach epoxy adhesive
Die Attachment
118-06-F
B-staged electrically conductive epoxy adhesive film
Die Attachment
125-22-F
B-staged electrically conductive, low flow epoxy adhesive film
Die Attachment
124-07-F
B-staged epoxy laminating adhesive
Die Attachment
122-07-F
B-staged thermally conductive epoxy adhesive film
Die Attachment
110-16(P)
Electrically conductive coating for tantalum capacitors and ceramic surfaces
Electroplating
120-02
Electrically conductive ink and coating for tantalum capacitors and ceramic surfaces
Electroplating
123-36
Electrically conductive coating
Electroplating
117-31
Electrically conductive ink for printing onto three dimensional surfaces
Electroplating
125-24
Sprayable, room temperature curing coating coating for use on plastic housings.
Electroplating
126-43
Solvent resistant electrically conductive ink
Electroplating
128-22
Solvent resistant electrically conductive ink that spontaneously self nucleates.
Electroplating
110-16i
Solvent resistant electrically conductive ink that spontaneously self nucleates.
Electroplating
116-48
Higher viscosity version of 110-16i
Electroplating
115-28
Higher viscosity version of 116-48
Electroplating
117-31i
Solvent resistant electrically conductive ink that spontaneously self nucleates.
Electroplating
121-21
Solvent resistant electrically conductive ink that spontaneously self nucleates.
Electroplating
121-25
Electrically conductive ink/coating
Electroplating
127-16
Electrically conductive ink/coating
Electroplating
118-41
Electrically conductive flexible ink which a high degree of solvent resistance especially to Acetone & methyl ethyl ketone
EMI-RFI
125-24
Room temperature curing coating for use on plastic housings.
EMI-RFI
118-09A/B119-44
Electrically conductive epoxy ink
EMI-RFI
102-05F
Electrically conductive, flexible ink for use on Kapton® (polyimide) and Mylar® (polyester) flex circuits
EMI-RFI
127-10
Electrically conductive ink for use on hard to stick to surfaces such as ITO
EMI-RFI
118-38(EU)
Waterborne electrically conductive coating for Low V.O.C. applications. NMP free
EMI-RFI
117-48
Electrically conductive modified epoxy/ink for printing narrow lines onto three dimensional and flat surfaces
EMI-RFI
118-43(LPS)
Extremely Flexible electrically conductive ink
EMI-RFI
118-29
Waterborne electrically conductive coating for Low V.O.C. applications.
EMI-RFI
124-47
Electrically conductive silicone ink for use on hard to stick to surfaces
EMI-RFI
111-27
Clear, flexible thermal curable dielectric for use over shielding conductive inks
EMI-RFI
129-02
Clear, flexible UV curable dielectric for use over shielding conductive inks
EMI-RFI
129-02(MR)
Clear, moisture resistant flexible UV curable dielectric for use over shielding conductive inks
EMI-RFI
GPC-251 A/B
Two-part room temperature curing silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices.
Flip Chip
GPC-352-1A/B-187
Low Temperature, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.
Flip Chip
GPC-352-1A/B119-44
Long pot life, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.
Flip Chip
118-06 (SD)
Single component, syringe dispensable, b-stageable electrically conductive epoxy die attach adhesive. Other versions available for different application methods.
Flip Chip
121-20A/B
Two-component low temperature curing silver filled epoxy adhesive exhibiting conductive only in the z-axis.
Flip Chip
121-23
Single component, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing
Flip Chip
120-27A/B-187
Black low viscosity two-component underfill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface
Flip Chip
113-33A/B
Sag-resistant black glob top flame-out two-component epoxy potting and encapsulating compound. This material is crack resistant with a working life greater than thirty minutes.
Flip Chip
102-11A/B-187
Crack resistant black flameout epoxy compound. This material features a long pot life and excellent resistance to thermal shock
Flip Chip
102-12A/B-187
Thermal-cycle resistant black epoxy compound with an excellent resistance to shock. This product requires mild heat cure and has a working life of greater than four hours.
Flip Chip
116-04A/B-187
Low viscosity two-component underfill potting and encapsulating compound. This product is designed for applications requiring extremely good thermal conductivity.
Flip Chip
123-38A/B-187
Low-viscosity two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity.
Flip Chip
118-09A/B119-44
Electrically conductive epoxy/ink for bus-bar and traces
LED Lighting
125-26A/B119-44
Fine line printable, 3 mil line widths, adheres to ITO
LED Lighting
127-01A/B119-44
Electrically conductive epoxy/ink for bus-bar and traces, ideal for polycarbonate substrates
LED Lighting
125-22
B-stageable conductive adhesive with low flow & low CTE. Can be used for mounting LEDS directly onto 118-09 or 125-26 conductive inks.
LED Lighting
124-08C
One component, low temperature curing electrically conductive epoxy adhesive with excellent thermal shock resistance.