Applications: Die Attachment

Die AttachmentCreative Materials’ 122-07(SP) and 124-06 are high performance screen-printable, b-stageable, highly thermally conductive, one-part epoxy adhesives and coatings. These materials have a long shelf life and has been proven to be reliable products. Applications for these materials include, but are not limited to: die attach adhesives, printed circuit board fabrication, advanced material composites and sealing and high performance coatings.

Creative Materials' 122-38(SD) is a syringe dispensable, one component, silver filled, electrically conductive, epoxy die attach adhesive. This product has excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. Creative Materials' 122-39(SD) is a syringe dispensable, 100% solids, thermally conductive, electrically insulating, one component epoxy adhesive. Applications for both of these materials include, but are not limited to: die attachment, printed circuit board fabrication, high performance coatings, and advanced material composites.
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Syringe Dispensable, B-Stageable, Electrically Conductive, Epoxy Adhesive

CMI #119-12

  • One Part
  • Excellent thermal stability

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Pad-Printable, B-Stagable, Electrically Conductive Epoxy Die Attach Adhesive

CMI #118-06(PP)

  • Can be applied with very finepattern definition on flat or geometrically complex surfaces
  • Can be applied directly to silicon waffers before die cutting
  • Ionically clean, micro-electronicsgrade of CMI# 118-06

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Screen-Printable, B-Stagable, Electrically Conductive Epoxy Die Attach Adhesive

CMI #118-06(SP)

  • Can be applied directly on silicon waffers before die cutting
  • Ionically clean, micro-electronicsgrade of CMI# 118-06

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Reworkable Thermoplastic Die Attach Adhesive

CMI# 117-26

  • Volume resistivity of 0.00008 ohm-cm
  • Used also for attaching large expansion mis-matched components and solder replacement on PC boards

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Please contact us today to discuss your requirements.