Applications: Flip Chip

GPC251A/BConductive Adhesives

GPC251A/B is a two-part room temperature curing, silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices.

GPC352-1A/B-187/119-44 is a two-part, heat curing, silver filled epoxy adhesive. 119-44 provides a longer pot life. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions. Applications include the following:

  • Bonding surface mount component to rigid PC boards
  • Attachment of electrical and electronic components
  • Heat sink attachments

118-06 is available in a pad-printable (PP), syringe dispensable (SD), screen-printable (SP), or stencible (ST) B-Stageable electrically conductive epoxy die attach adhesive. Applications include, but are not limited to:

  • Bonding capacitors to lead frames
  • Die Attach
  • Assembling electrical and electronic components
  • Mounting devices to flexible and rigid circuitry

Anisotropic Conductive Adhesives

121-20A/B is a two-component, low temperature curing, silver filled epoxy adhesive. Applications include, but are not limited to:

  • Conductive splicing of ribbon cables
  • Bonding of flex circuits to PC boards, E.L. panels and touch panels
  • Bonding of electrical components in applications where short circuits between closely spaced contact pads are a concern

121-23 is a screen-printable, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing. Some applications for this material include, but are not limited to:

  • Bonding of flex circuits to PC boards
  • Electrical attachment of surface mounted devices
  • Excellent adhesion to a variety of metallic contact pad compositions

Under Fill Materials (Dielectrics)

120-27A/B-187 is a black, low viscosity, two-component, under fill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure resulting in a smooth, pinhole free surface.

113-33A/B is a sag resistant black, glob top, flame-out, two component, epoxy potting and encapsulating compound. This material is a crack resistant material with a working life greater than thirty minutes.

102-11A/B187 is a crack resistant, black, flameout epoxy compound. This material features a long pot life and excellent resistance to thermal shock. Some applications include, but are not limited to:

  • Encapsulating
  • Bonding of electronics

102-12A/B-187 is a thermal cycle resistant, black epoxy compound with an excellent resistance to shock. This product requires mild heat cure and has a working life of greater than four hours.

116-04A/B-187 is a low viscosity, two-component under fill potting and encapsulating compound. This product is designed for application requiring extremely good thermal conductivity.

123-38A/B-187 is a low viscosity, two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity.

Flip Chip Product Bulletin [PDF]

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