Applications: Heat Sink Assembly

Pad-Printable, B-Stageable, Thermally Conductive Epoxy Adhesive

CMI #117-49

  • Outstanding chemical resistance
  • Excellent thermal stability
  • Used also in printed circuit board fabrication and as high performance coating

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Screen-Printable, B-Stageable, Thermally Conductive Epoxy Adhesive

CMI #119-24

  • Outstanding chemical resistance
  • Excellent thermal stability
  • Used also in printed circuit board fabrication and as high performance coating

View Data Sheet

Please contact us today to discuss your requirements.