|
|
Product |
Conductivity (ohm/sq/mil) |
Typical Cure |
Comments |
< 0.010 |
3-5 mins @ 110°C |
Carbon version, 112-48, can be blended with 125-15 to reduce
cost and conductivity |
|
< 0.015 |
5- 10 mins @ 120°C |
Carbon version, 108-46, can be blended with 101-59 for cost
and conductivity adjustment |
|
< 0.010 |
3-5 mins @ 110°C |
Faster Drying version of 101-59 |
|
< 0.020 |
15 mins @ 70°C |
Carbon version, 116-19, can be blended with 114-01 for cost
reduction |
|
< 0.015 |
8-12 mins @ 120°C |
Fine line version of 101-59 capable of 4 mils line widths and spacing. |
Carbon inks
Dielectric inks
Product |
Color
|
Description |
Blue, Matte |
100% solids, flexible, solvent resistant, low odor, UV curable dielectric ink and coating | |
Green, Matte |
100% solids, flexible, solvent resistant, low odor, UV curable dielectric ink and coating | |
Green, Translucent |
100% solids, flexible, solvent resistant, low odor, UV curable dielectric ink and coating | |
Clear |
100% solids, flexible, solvent resistant, low odor, UV curable dielectric ink and coating |
Conductive Adhesives
Product |
Volume Resistivity (ohm-cm) |
Comments |
< 0.0001 |
Flexible, Silicone Based Adhesive | |
<0.0004 |
1:1 mix ratio by weight, flexible epoxy adhesive, cures as low as 80°C | |
< 0.005 |
Room Temperature curing, two part adhesive with excellent bond strength. | |
< 0.0005 |
Flexible Thermoplastic Adhesive. |
Please contact us today to discuss your requirements.
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