Potting Compounds
Product Part A |
Product Part B |
Mix Ratio by Weight |
Working Life @ 21°C |
Description |
| F940A | F940B | 100:12 | 30 mins. | Black flame-out epoxy potting and encapsulating compound. Low viscosity, self de-aerating, thermally conductive. Room temperature cure. |
| F940A | B-187 | 100:3 | > 4 hours | Low viscosity with long pot life. Requires mild heat cure. |
| F947A | F947B | 100:12 | 30 mins. | Room temperature, improved heat resistance. Other properties similar to F940A/B. |
| F947A | B-187 | 100:3 | > 4 hours | Excellent heat resistance, extended pot life. Requires mild heat cure. |
| 102-11A | 102-11B | 100:12 | 30 mins. | Crack resistant black flame-out epoxy potting compound. Room temperature cure, improved resistance to thermal cycling. Other properties similiar to F947A/B. |
| 102-11A | B-187 | 100:3 | > 4 hours | Excellent resistance to thermal shock, longer pot life. Requires mild heat cure. |
| 102-12A | 102-12B | 100:9 | 30 mins. | Thermal-cycle resistant black epoxy potting compound. Room-temperature cure, improved crack resistance. High thermal conductivity. |
| 102-12A | B-187 | 100:2.5 | > 4 hours | Same as 102-12A/B, but extended pot life; better resistance to thermal cracking. |
| 113-33A | 113-33B | 100:15 | 30 mins. | Crack resistant black flame-out glob top epoxy. Non sag encapsulant. |
Product |
Viscosity (cps) @ 25°C |
Viscosity (cps) @ 50°C |
Description |
| 108-50 | 100k to 160k | 30k to 50k | Exceptional resistance to thermal cycling. Low stress, low shrink potting compound and adhesive. Ideal for stress-sensitive substrates. |
| 109-12 | 500k | 60k | Exceptional resistance to thermal cycling. Bonds dissimilar materials requiring Class “F+” service temperature rating. More thermally conductive version of 108-50. |
| 116-20 | 20k | - | Flexible UV-curable encapsulant |
discuss your requirements.