Thermally Conductive Adhesives

An increasing number of applications call for thermally conductive adhesives, in part due to significant heat generation by modern electronics components. Creative Materials' standard and custom formulations of thermally conductive adhesives feature outstanding thermal stability, chemical resistance, and high temperature properties. Our recent innovations include a flexible pre-catalyzed 100-percent solids epoxy adhesive, featuring high thermal conductivity, chemical resistance and elevated temperature properties.

Creative Materials' thermally conductive adhesives include one-part and two-part epoxy systems, as well as silicone and polyimide systems. Formulated for use in the manufacture of computer components and LEDs, our thermally conductive adhesives include highly effective thermal epoxies designed to bond a heat-producing component to a heat-sink. Additional applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment, heat-sink bonding, and bonding substrates with dissimilar coefficients of thermal expansion. We engineer our low-viscosity thermally conductive epoxy potting and encapsulating compounds to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface.

Order Sample Technical
Question
Product
Recommendation

1 Part Epoxy Resin Systems

Product
Viscosity
(cps)
Typical Cure*
Thermal
Conductivity
(W/mK)
Description
109-12 500k 2 hours at 150°C 5.65 Low-stress adhesive and potting compound.
122-07(SP) 23k 1 hour at 150°C 5.5 Die attach adhesive, B-stageable
122-39(SD) 100k 30 mins at 155°C 3.5 Syringe dispensable, die attach adhesive
127-15(SD) 100k 30 mins at 155°C 5.5 Syringe dispensable, die attach adhesive

2 Part Epoxy Resin Systems

Product
Viscosity (cps)
Typical Cure*
Thermal Conductivity (W/mK)
Description
116-03A/B-187 20k 30 mins at 100°C 1.73 Adhesive and potting compound. Can cure as low as 80°C.
116-04A/B-187 3600 30 mins at 100°C 2.63 Adhesive and potting compound. Can cure as low as 80°C.
122-24A/119-44 45k to 60k 1 hour at 80°C plus 1 hour at 125°C 2.35 Hi-temp, low stress underfill and adhesive
122-31A/119-44 100k to 150k 1 hour at 80°C plus 1 hour at 125°C 2.35 Thixotropic, hi-temp, low stress underfill and adhesive
123-38A/B-187 2000 30 mins at 100°C 1.34 Adhesive and potting compound. Can cure as low as 80°C.

Silicone Resin Systems

Product
Viscosity (cps)
Typical Cure*
Thermal Conductivity (W/mK)
Description
105-07 6000 10 mins at 160°C 2.4 Flexible adhesive

Polyimide Resin Systems

Product
Viscosity (cps)
Typical Cure*
Thermal Conductivity (W/mK)
Description
124-41 50,000 1 hour at 175°C 11.0 Hi-temp adhesive
*Typical cure listed. Please refer to technical data sheet or technical support staff for further curing parameters.

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