Thermally Conductive Adhesives

Creative Materials develops custom products for the most demanding applications.

 

 

 

 

1 Part Epoxy Resin Systems
Product
Viscosity (cps)
Typical Cure*
Thermal Conductivity (W/mK)
Description
500k
2 hours at 150°C
5.65
Low stress adhesive and potting compound.
23k
1 hour at 150°C
5.5
Die attach adhesive, B-stageable
100k
30 mins at 155°C
5.5
Syringe Dispensable, Die Attach Adhesive
 
2 Part Epoxy Resin Systems
Product
Viscosity (cps)
Typical Cure*
Thermal Conductivity (W/mK)
Description
20k
30 mins at 100°C
1.73
Adhesive and potting compound. Can cure as low as 80°C.
3600
30 mins at 100°C
2.63
Adhesive and potting compound. Can cure as low as 80°C.
45k to 60k
1 hour at 80°C plus 1 hour at 125°C
2.35
Hi-temp, low stress, underfill and adhesive
100k to 150k
1 hour at 80°C plus 1 hour at 125°C
2.35
Thixotropic, hi-temp, low stress, underfill and adhesive
2000
30 mins at 100°C
1.34
Adhesive and potting compound. Can cure as low as 80°C.
 
Silicone Resin Systems
Product
Viscosity (cps)
Typical Cure*
Thermal Conductivity (W/mK)
Description
105-07
6000
10 mins at 160°C
2.4
Flexbile Adhesive
 
Polyimide Resin Systems
Product
Viscosity (cps)
Typical Cure*
Thermal Conductivity (W/mK)
Description
50,000
1 hour at 175°C
2.96
Hi-temp adhesive

*Typical cure listed. Please refer to technical data sheet or technical support staff for further curing parameters.

Please contact us today to discuss your requirements.