Die Attachment

Die Attachment

Creative Materials’ 122-07(SP) and 124-06 are high performance screen-printable B-stageable highly thermally conductive one-part epoxy adhesives and coatings. These materials have a long shelf life and have proven reliability. Applications for these materials include, but are not limited to: die attach adhesives, printed circuit board fabrication, advanced material composites and sealing, and high performance coatings.

Creative Materials’ 122-38(SD) is a syringe-dispensable one component silver-filled electrically conductive epoxy die attach adhesive. This product has excellent thermal stability, outstanding chemical resistance, and excellent high-temperature properties. Creative Materials’ 122-39(SD) is a syringe-dispensable 100% solids thermally conductive electrically insulating one component epoxy adhesive. Applications for both materials include, but are not limited to: die attachment, printed circuit board fabrication, high performance coatings, and advanced material composites. See the full selector guide.

Syringe-Dispensable B-stageable Electrically Conductive Epoxy Adhesive

118-06(SD)

  • One-part
  • Excellent thermal stability
View Data Sheet

Pad-Printable B-stagable Electrically Conductive Epoxy Die Attach Adhesive

118-06(PP)

  • Can be applied with very fine pattern definition on flat or geometrically complex surfaces
  • Can be applied directly to silicon wafers before die cutting
  • Ionically clean, micro-electronics grade
View Data Sheet

Screen-printable B-stagable Electrically Conductive Epoxy Die Attach Adhesive

118-06(SP)

  • Can be applied directly on silicon wafers before die cutting
  • Ionically clean, micro-electronics grade
View Data Sheet

Reworkable Thermoplastic Die Attach Adhesive

117-26

  • Volume resistivity of 0.00008 ohm-cm
  • Used also for attaching large expansion mis-matched components and as solder replacement on PC boards
View Data Sheet
Please contact us today to discuss your requirements.