Flip chip mounting is a form of die attachment in which the chip is inverted to bring the adhesive into direct contact with the circuit board, allowing for a much smaller chip assembly and a more direct and higher signal density. Electrically conductive adhesives can be used in flip chip assembly as solder replacement when temperature-sensitive components or carriers are used. In order to facilitate finer tolerances required in some flip chip assembly, Creative Materials has developed a wide variety of anisotropic conductive adhesives that can be applied using wafer backside coating or applied directly to the carrier. These anisotropic adhesives are needed in applications where short circuits between closely spaced pads are a concern. Underfill materials are specialty engineered epoxies that fill the area between the die and carrier, designed to control stress in adhesive points caused by differences in thermal expansion between the die and the carrier and to act as a heat bridge to keep the chip cool.
| Product | Description | Pot Life | Recommended Cure Schedules |
|---|---|---|---|
| GPC-251 A/B | Two-part room temperature curing silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices. | 60 mins | 24 hours @ room temp 5 mins @ 120°C |
| GPC-352-1A/B-187 | Low Temperature, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions. | 4 hours | 90 mins @ 80°C 30 mins @ 125°C 15 mins @ 150°C |
| GPC-352-1A/B119-44 | Long pot life, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions. | 2 to 4 days | 60 mins @ 100°C 30 mins @ 125°C 15 mins @ 150°C |
| 118-06 (SD) | Single component, syringe dispensable, b-stageable electrically conductive epoxy die attach adhesive. Other versions available for different application methods. | 2 months | 60 min @ 150°C 30 mins at 175°C |
| Product | Description | Pot Life | Recommended Cure Schedules |
|---|---|---|---|
| 121-20A/B | Two-component low temperature curing silver filled epoxy adhesive exhibiting conductive only in the z-axis. | 2 to 4 days | 90 mins @ 80°C 30 mins @ 125°C 15 mins @ 150°C |
| 121-23 | Single component, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing | 2 months | 60 min @ 150°C 30 mins at 175°C |
| Product | Description | Pot Life | Recommended Cure Schedules |
|---|---|---|---|
| 120-27A/B-187 | Black low viscosity two-component underfill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface | > 2 hours | 20 hours @ 60°C |
| 113-33A/B | Sag-resistant black glob top flame-out two-component epoxy potting and encapsulating compound. This material is crack resistant with a working life greater than thirty minutes. | > 4 hours | 120 mins @ 80°C 30 mins @ 100°C |
| 102-11A/B-187 | Crack resistant black flameout epoxy compound. This material features a long pot life and excellent resistance to thermal shock | > 4 hours | 120 mins @ 80°C 30 mins @ 100°C |
| 102-12A/B-187 | Thermal-cycle resistant black epoxy compound with an excellent resistance to shock. This product requires mild heat cure and has a working life of greater than four hours. | > 4 hours | 60 mins @ 80°C 30 mins @ 100°C |
| 116-04A/B-187 | Low viscosity two-component underfill potting and encapsulating compound. This product is designed for applications requiring extremely good thermal conductivity. | > 4 hours | 60 mins @ 80°C 30 mins @ 100°C |
| 123-38A/B-187 | Low-viscosity two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity. | > 4 hours | 60 mins @ 80°C 30 mins @ 100°C |
