Data Sheets – Creative Materials

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Product	Description
126-40	Flexible fine feature epoxy adhesive	Bonding Electronic Components
126-14	Low temperature curing adhesive	Bonding Electronic Components
118-34	B-Stageable, electrically conductive epoxy adhesive with high reflow properties	Bonding Electronic Components
118-06(SP)	B-Stageable, electrically conductive epoxy adhesive with moderate reflow properties	Bonding Electronic Components
122-38(SD)	Ionically clean die attach adhesive	Bonding Electronic Components
124-08A/B	Two Part, thermal shock resistant, electrically conductive epoxy adhesive	Bonding Electronic Components
124-08C	Single component version of 124-08A/B	Bonding Electronic Components
102-32G1	Flexible conductive adhesive, lower resistivity version of 102-32	Bonding Electronic Components
125-22	B-Stageable, electrically conductive epoxy adhesive with low reflow properties	Bonding Electronic Components
GPC-251A/B	Two Part, room temperature curing, electrically conductive epoxy adhesive	Bonding Electronic Components
GPC-251A/CA-414	Higher bond strength & lower viscosity version of GPC-251A/B	Bonding Electronic Components
122-07	Highly thermally conductive epoxy adhesive, B-Stageable	Bonding Electronic Components
122-39(SD)	Ionically clean die attach adhesive	Bonding Electronic Components
127-31	Elastomeric, flexible thermally conductive adhesive/potting compound	Bonding Electronic Components
126-32R	Red Jettable epoxy surface mount adhesive	Bonding Electronic Components
126-32B	Blue Jettable epoxy surface mount adhesive	Bonding Electronic Components
126-32Bk	Black Jettable epoxy surface mount adhesive	Bonding Electronic Components
124-07	B-Stageable laminating epoxy adhesive	Bonding Electronic Components
113-33A/B	Crack resistant, black, flame-out epoxy	Bonding Electronic Components
102-32	Silicone pressure sensitive adhesive. Exhibits overall balance of peel strength, cohesion, lap shear strength and high temperature holding power	Surface Mount Attachment
102-32D	Silicone pressure sensitive adhesive. Exhibits overall balance of peel strength, cohesion, lap shear strength and high temperature holding power	Surface Mount Attachment
107-02	Reworkable, Environmentally friendly with an odorless solvent. Maintains flexibility at very low temperatures.	Surface Mount Attachment
118-15A/B	Easy to use 1 to 1 mix ratio. Pot life < 4 days. Excellent bonding to rigid circuitry.	Surface Mount Attachment
119-12	Useful in applications where a delay between the application of the adhesive and the final bonding of parts is desired	Surface Mount Attachment
119-05	Prior to curing is designed to remain in a liquid state for up to 5 days without drying out. Excellent bonding to rigid circuitry.	Surface Mount Attachment
124-08C	One component, 80°C curing.	Surface Mount Attachment
GPC-251A/B2612	Two part, room temperature, flexible conductive adhesive.	Surface Mount Attachment
120-02	Flexible, Medium Viscosity Electrically Conductive Adhesive	Crystal Oscillators
110-16	Flexible, Low Viscosity Electrically Conductive Adhesive	Crystal Oscillators
124-08A/B	High Bond Strength, excellent Thermal cycling Electrically Conductive Adhesive	Crystal Oscillators
124-08C	Pre-mixed, one-component version of 124-08A/B	Crystal Oscillators
109-12	Extremely Thermally Conductive Lid Attach Adhesives	Crystal Oscillators
122-07	Thermally Conductive B-Stageable Lid Attach Adhesive	Crystal Oscillators
108-50	Low Shrinkage, Excellent Thermal Cycling Lid Attach Adhesive	Crystal Oscillators
128-27	Low CTE, fast curing epoxy adhesive, ideal for sensitive substrates	Crystal Oscillators
124-07	Excellent Thermal Cycling, B-Stageable Lid Attach Adhesive	Crystal Oscillators
124-07HV	Higher viscosity version of 124-07	Crystal Oscillators
GPC-251A/B	Two Part, room temperature curing, electrically conductive epoxy adhesive	Die Attachment
122-47	Die attach polyimide electrically conductive adhesive	Die Attachment
118-34	Screen-Printable, b-Stageable, electrically conductive epoxy adhesive. Excellent flexibility in B-staged form	Die Attachment
118-06(SD)	Pad-Printable, b-Stageable, electrically conductive epoxy adhesive. Excellent thermal stability.	Die Attachment
125-22	B-stageable conductive adhesive with low flow & low CTE, increased flexibility	Die Attachment
122-38(SD)	Syringe dispensable, one component silver filled electrically conductive adhesive.	Die Attachment
Electraset 620	Die Attach grade conductive epoxy/adhesive for high throughput applications	Die Attachment
Electraset 620-2	Die Attach grade conductive epoxy/adhesive with excellent thermal cycle properties	Die Attachment
Electraset 620-3	Die Attach grade conductive epoxy/adhesive with highest thermal conductivity	Die Attachment
Electraset 620-4	Die Attach grade conductive epoxy/adhesive with no bleed on gold contacts	Die Attachment
122-07(SP)	Screen-Printable, b-Stageable, thermally conductive epoxy adhesive. Excellent flexibility in B-staged form	Die Attachment
127-12	Die attach grade thermally conductive epoxy adhesive	Die Attachment
122-39(SD)	One component thermally conductive adhesive.	Die Attachment
127-15(SD)	Thermally conductive flexible die attach epoxy adhesive	Die Attachment
118-06-F	B-staged electrically conductive epoxy adhesive film	Die Attachment
125-22-F	B-staged electrically conductive, low flow epoxy adhesive film	Die Attachment
124-07-F	B-staged epoxy laminating adhesive	Die Attachment
122-07-F	B-staged thermally conductive epoxy adhesive film	Die Attachment
110-16(P)	Electrically conductive coating for tantalum capacitors and ceramic surfaces	Electroplating
120-02	Electrically conductive ink and coating for tantalum capacitors and ceramic surfaces	Electroplating
123-36	Electrically conductive coating	Electroplating
117-31	Electrically conductive ink for printing onto three dimensional surfaces	Electroplating
125-24	Sprayable, room temperature curing coating coating for use on plastic housings.	Electroplating
126-43	Solvent resistant electrically conductive ink	Electroplating
128-22	Solvent resistant electrically conductive ink that spontaneously self nucleates.	Electroplating
110-16i	Solvent resistant electrically conductive ink that spontaneously self nucleates.	Electroplating
116-48	Higher viscosity version of 110-16i	Electroplating
115-28	Higher viscosity version of 116-48	Electroplating
117-31i	Solvent resistant electrically conductive ink that spontaneously self nucleates.	Electroplating
121-21	Solvent resistant electrically conductive ink that spontaneously self nucleates.	Electroplating
121-25	Electrically conductive ink/coating	Electroplating
127-16	Electrically conductive ink/coating	Electroplating
118-41	Electrically conductive flexible ink which a high degree of solvent resistance especially to Acetone & methyl ethyl ketone	EMI-RFI
125-24	Room temperature curing coating for use on plastic housings.	EMI-RFI
118-09A/B119-44	Electrically conductive epoxy ink	EMI-RFI
102-05F	Electrically conductive, flexible ink for use on Kapton® (polyimide) and Mylar® (polyester) flex circuits	EMI-RFI
127-10	Electrically conductive ink for use on hard to stick to surfaces such as ITO	EMI-RFI
118-38(EU)	Waterborne electrically conductive coating for Low V.O.C. applications. NMP free	EMI-RFI
117-48	Electrically conductive modified epoxy/ink for printing narrow lines onto three dimensional and flat surfaces	EMI-RFI
118-43(LPS)	Extremely Flexible electrically conductive ink	EMI-RFI
118-29	Waterborne electrically conductive coating for Low V.O.C. applications.	EMI-RFI
124-47	Electrically conductive silicone ink for use on hard to stick to surfaces	EMI-RFI
111-27	Clear, flexible thermal curable dielectric for use over shielding conductive inks	EMI-RFI
129-02	Clear, flexible UV curable dielectric for use over shielding conductive inks	EMI-RFI
129-02(MR)	Clear, moisture resistant flexible UV curable dielectric for use over shielding conductive inks	EMI-RFI
GPC-251 A/B	Two-part room temperature curing silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices.	Flip Chip
GPC-352-1A/B-187	Low Temperature, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.	Flip Chip
GPC-352-1A/B119-44	Long pot life, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.	Flip Chip
118-06 (SD)	Single component, syringe dispensable, b-stageable electrically conductive epoxy die attach adhesive. Other versions available for different application methods.	Flip Chip
121-20A/B	Two-component low temperature curing silver filled epoxy adhesive exhibiting conductive only in the z-axis.	Flip Chip
121-23	Single component, B-stageable, anisotropically conductive, epoxy adhesive suitable for application by screen-printing, dipping and syringe dispensing	Flip Chip
120-27A/B-187	Black low viscosity two-component underfill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface	Flip Chip
113-33A/B	Sag-resistant black glob top flame-out two-component epoxy potting and encapsulating compound. This material is crack resistant with a working life greater than thirty minutes.	Flip Chip
102-11A/B-187	Crack resistant black flameout epoxy compound. This material features a long pot life and excellent resistance to thermal shock	Flip Chip
102-12A/B-187	Thermal-cycle resistant black epoxy compound with an excellent resistance to shock. This product requires mild heat cure and has a working life of greater than four hours.	Flip Chip
116-04A/B-187	Low viscosity two-component underfill potting and encapsulating compound. This product is designed for applications requiring extremely good thermal conductivity.	Flip Chip
123-38A/B-187	Low-viscosity two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity.	Flip Chip
118-09A/B119-44	Electrically conductive epoxy/ink for bus-bar and traces	LED Lighting
125-26A/B119-44	Fine line printable, 3 mil line widths, adheres to ITO	LED Lighting
127-01A/B119-44	Electrically conductive epoxy/ink for bus-bar and traces, ideal for polycarbonate substrates	LED Lighting
125-22	B-stageable conductive adhesive with low flow & low CTE. Can be used for mounting LEDS directly onto 118-09 or 125-26 conductive inks.	LED Lighting
124-08C	One component, low temperature curing electrically conductive epoxy adhesive with excellent thermal shock resistance.	LED Lighting
122-07(SP)	Highly thermally conductive epoxy adhesive, B-Stageable	LED Lighting
125-31FPC	One component, fine particle low temperature curing thermally conductive epoxy adhesive with excellent thermal shock resistance.	LED Lighting
125-50	Opaque White dielectric solder mask for increasing LED reflectivity , adheres to ITO	LED Lighting
116-20LH	Highly flexible low haze clear dielectric encapsulant	LED Lighting
128-13LVA/B	Room temperature curing silicone encapsulant & sealant	LED Lighting
128-16A/B	Room temperature curing urethane encapsulant & sealant	LED Lighting
125-20	Chemically resistant electrode ink, popular for cathode use	Medical Electrodes
126-49(SP)A/B	Elastomeric electrode ink for reference electrodes, popular for reference electrodes	Medical Electrodes
117-43	Water-borne electrode ink, popular for EEG electrodes	Medical Electrodes
117-43(EU)	Water-borne electrode ink, NMP free, popular for EEG electrodes	Medical Electrodes
113-09	Standard electrode ink for ECG and reference electrodes	Medical Electrodes
113-09(LPS)	More flexible, solvent resistant version of 113-09, ideal for TPU	Medical Electrodes
113-09(S)	Increased solvent resistant version of 113-09	Medical Electrodes
113-09H	Hydrophilic version of 113-09	Medical Electrodes
117-23	Standard electrode ink for defibrillation electrodes	Medical Electrodes
117-23(S)	Increased solvent resistant version of 117-23, popular for defibrillation electrodes	Medical Electrodes
124-36	Standard electrode ink, popular for defibrillation and pacing	Medical Electrodes
125-21	Chemically resistant electrode ink, popular for reference electrode and cathodes	Medical Electrodes
106-12	Standard electrode material for ECG	Medical Electrodes
119-10	Electrode ink, popular for ECG and EEG electrodes	Medical Electrodes
128-06(PP)	Electrode ink, popular for ECG and reference electrodes	Medical Electrodes
127-11	Electrode ink for ECG electrodes	Medical Electrodes
115-02	Electrode ink for ECG electrodes	Medical Electrodes
114-26B	Medical electrode film with 0.8-0.9mils DFT, popular for ECG and reference electrode	Medical Electrodes
114-26A	Medical electrode film with 0.4-0.5mils DFT, popular for ECG and reference electrode	Medical Electrodes
129-05	Ag/AgCl conductive polymer coated film	Medical Electrodes
129-08	Silver/Carbon/Ag/AgCl polymer coated film	Medical Electrodes
112-15A	Standard membrane switch conductive ink.	Membrane Switch
125-10	Economical conductive ink.	Membrane Switch
125-10ADP	Abrasion resistant economical conductive ink	Membrane Switch
125-13HV	Fine line printable, 3 to 4 mil widths and spaces, high viscosity	Membrane Switch
108-06	UV curable conductive ink	Membrane Switch
126-33	Abrasion resistant extremely conductive ink	Membrane Switch
125-26A/B119-44	Fine line printable, 3 mil line widths, adheres to ITO	Membrane Switch
112-48A	Standard membrane switch resistive ink	Membrane Switch
124-50	Resistive conductive ink ideal for urethane and polycarbonate substrates	Membrane Switch
126-48	Resistive conductive ink ideal for printed heaters	Membrane Switch
127-24PB	Highly flexible blue dielectric.	Membrane Switch
127-24PG	Highly flexible green dielectric.	Membrane Switch
102-32	High temperature, flexible silicone adhesive.	Membrane Switch
124-08C	One component, long pot life, flexible conductive adhesive	Membrane Switch
GPC-251A/B2612	Two part, room temperature, flexible conductive adhesive	Membrane Switch
124-33	Extremely flexible conductive adhesive	Membrane Switch
118-09A/B119-44	Solvent resistant low temperature curing, flexible conductive epoxy ink for ITO/TCO coated substrates	Solar Cells
118-09C	Ready to print, precatalyzed and frozen version of 118-09A/B119-44	Solar Cells
128-18A/B119-44	Fine line solvent resistant low temperature curing, flexible conductive epoxy ink for ITO/TCO coated substrates	Solar Cells
120-07	Fast curing, thermoplastic conductive ink for ITO/TCO coated substrates	Solar Cells
125-13HV	Fine line electrically conductive ink with low contact resistance and minimal spreading during cure.	Solar Cells
EXP 2631-21C	Electrically conductive ink suitable for OPV modules	Solar Cells
124-08C	One component flexible conductive adhesive	Solar Cells
122-38(SD)	Ionically clean die attach adhesive	Solar Cells
GPC 251A/B	Two part, room temperature curing conductive adhesive	Solar Cells
122-30	Ceramic filled thermoplastic adhesive suitable for low energy substrates with spacer beads	Solar Cells
116-20	Highly flexible clear UV curing dielectric coating, encapsulant and ink	Solar Cells
128-13LVA/B	Room temperature curing silicone encapsulant & sealant	Solar Cells
117-38	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device	Solder Masks
118-26	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device	Solder Masks
118-27	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device	Solder Masks
125-50	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device	Solder Masks
122-01(P)	One component. Solvent strip-able. Useful as a solder resistant coating for electrical and electronic device	Solder Masks
109-12	Thermally conductive, best for thermal mismatches and thermal cycling.	Thermal Management
122-07(SP)	B-stageable, high thermal conductivity adhesive	Thermal Management
127-15(SD)	Syringe dispensable thermally conductive flexible die attach epoxy adhesive	Thermal Management
125-31FPC	One component, fine particle low temperature curing thermally conductive epoxy adhesive with excellent thermal shock resistance.	Thermal Management
122-39(SD)	Thermally conductive Die attach adhesive	Thermal Management
122-07-F	B-staged, thermally conductive adhesive film adhesive	Thermal Management
127-03	Highly thermally conductive epoxy adhesive, B-Stageable	Thermal Management
127-31	Elastomeric, flexible thermally conductive adhesive/potting compound	Thermal Management
117-49	B-stageable, thermally conductive coating and adhesive	Thermal Management
122-29	Low stress, thermally conductive epoxy adhesive	Thermal Management
126-40	Flexible fine feature epoxy adhesive	Thermal Management
121-47	Electrically conductive/thermally conductive via filling paste.	Thermal Management
102-32G1	Flexible electrically/thermally conductive adhesive, lower resistivity version of 102-32	Thermal Management
127-48	Solvent resistant washable conductive ink	Wearable Electronics
127-07	Elastomeric washable conductive ink	Wearable Electronics
127-48LR	Washable resistive ink	Wearable Electronics
128-07	Elastomeric washable resistive ink	Wearable Electronics
127-48D	Solvent resistant washable dielectric ink/coating	Wearable Electronics
127-14	Elastomeric washable dielectric ink/coating	Wearable Electronics
128-13LVA/B	Room temperature curing silicone encapsulant & sealant	Wearable Electronics
906-57A/B	Room temperature curing two component urethane encapsulant	Wearable Electronics
125-22	B-stageable conductive adhesive with low flow & low CTE	Wearable Electronics
122-38(SD)	Ionically clean die attach adhesive	Wearable Electronics
GPC-251A/B2612	Two part, room temperature, flexible conductive adhesive	Wearable Electronics
128-39	Dielectric adhesive and coating	Heat Transfer
127-48	Solvent resistant washable conductive ink	Heat Transfer
127-48LR	Solvent resistant washable resistive ink	Heat Transfer
120-07	Electrically conductive urethane ink	Heat Transfer
124-50	Resistive urethane ink	Heat Transfer
124-33	Electrically conductive urethane adhesive	Heat Transfer
112-48A	Standard membrane switch resistive ink	Flexible Heaters
126-48	Resistive conductive ink ideal for printed heaters	Flexible Heaters
125-14	High resistance ink, blend-able with 126-48	Flexible Heaters
123-18	Extremely resistance ink. Blend-able with 112-48A	Flexible Heaters
124-50(LPS)	Resistive ink for ITO or and polycarbonate	Flexible Heaters
127-48LR	Solvent resistant washable resistive ink	Flexible Heaters
128-07	Elastomeric resistive ink for fabrics	Flexible Heaters
126-28	Abrasion resistant ink	Flexible Heaters
126-03(SP)C	Elastomeric silicone resistive ink, non-flammable	Flexible Heaters
114-34	Low temperature curing two component, epoxy ink. Adheres to ITO	Flexible Heaters
120-24	High temp epoxy ink, adheres to ITO and polyimide substrates	Flexible Heaters
127-06	High resistance ink, blend-able with 120-24, ideal for strain gauges	Flexible Heaters
121-35(UT)	Polyimide resistive ink for very high service temperatures	Flexible Heaters
119-28	Very flexible resistive ink	Flexible Heaters
124-43	Water based resistive ink	Flexible Heaters
110-04	Solvent based resistive ink	Flexible Heaters
129-14(LR)	Low resistance fast curing epoxy ink, designed for polycarbonate substrates	Flexible Heaters
129-14(MR)	Moderate resistance fast curing epoxy ink, designed for polycarbonate substrates	Flexible Heaters
129-14(HR)	High resistance fast curing epoxy ink, designed for polycarbonate substrates	Flexible Heaters
112-15A	Extremely conductive ink	Flexible Heaters
126-09	Economical conductive ink	Flexible Heaters
125-10	Economical conductive ink	Flexible Heaters
125-10ADP	Economical conductive ink, harder version of 125-10	Flexible Heaters
124-18	Translucent white, adheres ITO or and polycarbonate	Flexible Heaters
116-20	Highly flexible clear dielectric	Flexible Heaters
118-12A/B119-44	Clear, flexible epoxy dielectric, adheres to ITO	Flexible Heaters
122-01(UT)	High service temperature polyimide dielectric	Flexible Heaters
110-03	Solvent based electrically conductive ink	RFID antennas
125-28	Solvent based electrically conductive ink	RFID antennas
118-38	Water-borne conductive ink	RFID antennas
112-15A	Extremely conductive ink	RFID antennas
125-13HV	Fine line electrically conductive ink with low contact resistance and minimal spreading during cure.	RFID antennas
126-33	Extremely conductive ink	RFID antennas
125-01A/B-187	Snap cure anisotropic electrically conductive epoxy adhesive	RFID antennas
124-34A/B-187	Snap cure electrically conductive epoxy adhesive	RFID antennas
128-32FP	Anisotropic B-Stageable electrically conductive epoxy adhesive	RFID antennas
118-06(SP)	Electrically conductive B-Stageable epoxy adhesive	RFID antennas
116-20	Highly flexible clear UV curing dielectric coating, encapsulant and ink	RFID antennas
128-13LVA/B	Room temperature curing silicone encapsulant & sealant	RFID antennas
120-07	Electrically conductive ink ideal for PET or TPU substrates	Electroluminescence (EL)
118-09A/B119-44	Electrically conductive ink ideal for ITO substrates	Electroluminescence (EL)
124-50	Electrically resistive ink ideal for PET or TPU substrates	Electroluminescence (EL)
114-34A/B	Electrically resistive ink ideal for ITO substrates	Electroluminescence (EL)
124-31	Translucent conductive ink	Electroluminescence (EL)
128-45	Flexible Phosphor ink	Electroluminescence (EL)
128-50LPW	Flexible Phosphor ink	Electroluminescence (EL)
128-50LPE	Flexible Phosphor ink	Electroluminescence (EL)
114-14A	High dielectric constant ink ideal for PET or TPU substrates	Electroluminescence (EL)
128-40(S)	High dielectric constant ink ideal for ITO substrates	Electroluminescence (EL)
128-49	Dielectric ink	Electroluminescence (EL)

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