127-07
Elastomeric conductive ink
View
112-15A
Standard membrane switch conductive ink.
View
125-10
Economical conductive ink.
View
125-13
Fine line printable, 3 to 4 mil widths and spaces.
View
118-38(EU)
Abrasion resistant, water-based, NMP free
View
120-07(LPS)
Electrically conductive for ITO and polycarbonate
View
126-33
Abrasion resistant extremely conductive ink
View
125-26A/B119-44
Fine line printable, 3 mil line widths, adheres to ITO
View
118-09A/B119-44
Low temp curing, adheres to ITO
View
126-21C
Economical Conductive ink for ITO
View
125-19(SP)C
Elastomeric silicone conductive ink, non-flammable
View
118-41
Shielding of polyimide flex circuits. Good for high temperatures.
View
125-13HT
Polyimide fine line printable, 3mil line widths, high flexibility
View
110-19(UT)
Polyimide ink for very high service temperatures.
View
117-31
Plateable conductive ink
View
127-20A/B
Low temp curing, adhesion to difficult substrates
View
119-21
Abrasion resistant, adheres to ITO
View
118-43(LPS)
Extremely flexible electrically conductive ink, ideal for elastomeric and difficult substrates
View
124-02
Water based conductive ink.
View
125-28
Conductive ink for high speed printing processes.
View
110-03
Solvent based conductive ink
View
127-10
Low temp curing, adheres to polycarbonate
View
125-10ADP
Abrasion resistant economical conductive ink
View
126-09
Economical conductive ink
View
125-43C
Economical Conductive ink for ITO
View
121-30
Carbon/Silver conductive ink
View
125-46A/B
Economical conductive epoxy adhesive
View
126-35
Economical high coverage conductive coating
View
126-45
Economical conductive ink ideal for urethane & vinyl
View
112-48A
Standard membrane switch resistive ink
View
127-48LR
Washable resistive ink
View
126-48
Resistive conductive ink ideal for printed heaters
View
125-14
High resistance ink, blend-able with 126-48
View
123-18
Extremely resistant ink. Blend-able with 112-48
View
124-50(LPS)
Resistive ink for ITO or and polycarbonate
View
124-39(EU)
Abrasion resistant, water-based, NMP free
View
128-07
Elastomeric resistive ink
View
126-28
Abrasion resistant ink
View
126-03(SP)C
Elastomeric silicone resistive ink, non-flammable
View
114-34
Low temperature curing two component, epoxy ink. Adheres to ITO
View
120-24
High temp epoxy ink, adheres to ITO and polyimide substrates
View
127-06
High resistance ink, blend able with 120-24, ideal for strain gauges
View
121-35(UT)
Polyimide resistive ink for very high service temperatures
View
119-28
Very flexible resistive ink
View
124-43
Water based resistive ink
View
110-04
Solvent based resistive ink
View
127-24
Highly flexible green dielectric.
View
127-24PB
Highly flexible blue dielectric.
View
116-20LH
Highly flexible low haze clear dielectric
View
127-48D
Solvent resistant washable dielectric ink ideal for fabrics
View
124-18(LPS)
Translucent white, adheres ITO or and polycarbonate
View
126-26/B-507
Elastomeric silicone dielectric ink
View
126-26(SP)A/B
Non-Flammable Silicone dielectric ink and coating
View
128-03A/B-187
Black, flexible epoxy dielectric, adheres to ITO
View
118-08A/B119-44
Blue, flexible epoxy dielectric, adheres to ITO
View
118-12A/B119-44
Clear, flexible epoxy dielectric, adheres to ITO
View
125-50
Opaque White epoxy dielectric, adheres to ITO
View
128-31
High dielectric constant ink for low temperature substrates
View
114-14A
High dielectric constant epoxy ink for capacitive layers
View
122-01(UT)
High service temperature polyimide dielectric
View
122-01(P)
Polyimide dielectric, high flexibility
View
118-02
Flexible, epoxy dielectric
View
119-07
High dielectric strength coating/ink
View
122-06
High dielectric constant for capacitive layers
View
111-27
High dielectric strength coating
View
128-40(S)
Chemically resistant high dielectric constant ink
View
129-02
Clear, flexible UV curable dielectric for use over shielding conductive inks
View
129-02(MR)
Clear, moisture resistant flexible UV curable dielectric for use over shielding conductive inks
View
113-15
Low temperature curing, flexible & highly filled, ideal for polyester
View
125-09
Very flexible, low temperature curing, ideal for urethane
View
125-09PC
Very flexible, low temperature curing, ideal for polycarbonate
View
125-09TS
Very abrasion resistant, thermosetting version of 125-09, ideal for urethane
View
128-08
Very flexible pink radio opaque
View
119-31
Very flexible, low temperature curing, ideal for urethane
View
119-31TS
Very flexible, low temperature curing, ideal for urethane, increased solvent resistance
View
113-49
Flexible, abrasion resistant radio opaque ink
View
114-29A/B
Abrasion resistant, solvent resistant ideal for PEEK and similar substrates
View
124-17
Abrasion resistant, solvent resistant epoxy ink
View
124-35A/B-507
Elastomeric ink with adhesive properties and ideal for silicone substrates
View
124-25
Abrasion resistant, solvent resistant epoxy ink
View
125-09MDB
Very flexible blue radio opaque ink.
View
114-29B A/B
Abrasion resistant, blue, solvent resistant & ideal for PEEK and similar substrates
View
114-29G A/B
Abrasion resistant, green, solvent resistant & ideal for PEEK and similar substrates
View
118-06(SP)
B-stageable conductive adhesive.
View
125-22
B-stageable conductive adhesive with low flow & low CTE
View
125-22C119-44
Lower temperature curing version of 125-22
View
124-33(S)
Extremely flexible conductive adhesive
View
118-06(SD)
B-Stageable conductive adhesive
View
127-49A/B
Two part, room temperature curing silicone conductive adhesive
View
118-15A/B
Two part, long pot life, general purpose conductive adhesive. Available as one component
View
805-19C
One component room temperature curing
View
128-17A/B
Fast curing, room temperature curing conductive adhesive
View
GPC-251A/B
Two part, room temperature curing conductive adhesive
View
GPC -251A/CA-414
Two part, room temperature curing conductive adhesive
View
122-38(SD)
Ionically clean die attach adhesive
View
GPC-251A/B2612
Two part, room temperature, flexible conductive adhesive
View
124-08A/B
Two part, long pot life, flexible conductive adhesive
View
102-32NFC
High temperature, flexible silicone adhesive, non-flammable
View
102-32
High temperature, flexible silicone adhesive.
View
102-32RT
High temperature, flexible silicone adhesive, low temperature curing
View
126-40
Flexible fine feature epoxy adhesive
View
124-08LVC
Single component conductive adhesive.
View
128-33
High temperature single component conductive adhesive
View
125-19FS/B-507
Elastomeric silicone conductive ink
View
125-19(SP)A/B
Elastomeric silicone conductive ink, non-flammable
View
120-07LPS
Flexible/elastomeric conductive ink ideal for urethane substrates
View
126-03/B-507
Elastomeric carbon silicone resistive ink
View
126-03(SP)A/B
Elastomeric carbon silicone resistive ink, non-flammable
View
127-14
Elastomeric dielectric ink
View
126-26
Elastomeric silicone dielectric ink
View
126-08
Extremely high thermally conductive epoxy adhesive
View
122-07(SP)
Highly thermally conductive epoxy adhesive, B-Stageable
View
125-31FPC
Highly thermally conductive epoxy adhesive, B-Stageable, low temperature curing
View
127-03
Highly thermally conductive epoxy adhesive, B-Stageable
View
109-12
Low stress, high thermally conductive adhesive/potting compound
View
125-35C
Highly thermally conductive epoxy adhesive
View
127-31
Elastomeric, flexible thermally conductive adhesive/potting compound
View
116-04C
Highly thermally conductive epoxy adhesive/potting compound
View
122-39(SD)
Ionically clean die attach adhesive
View
108-50
Low stress, moderate thermally conductive adhesive/potting compound
View
108-50MG
Microelectronics grade, low stress, moderate thermally conductive adhesive/potting compound
View
813-04
One component thermally conductive semi-flexible epoxy
View
128-21C
Low stress thermally highly thermally conductive epoxy adhesive
View
125-35A/B
Highly thermally conductive epoxy adhesive
View
125-31A/B
Highly thermally conductive epoxy adhesive, higher viscosity version of 125-35A/B
View
116-04A/B-187
Highly thermally conductive epoxy adhesive/potting compound
View
810-44-2A/B
Highly thermally conductive epoxy adhesive
View
122-24A/B119-44
Highly thermally conductive low stress underfill adhesive
View
122-31A/B119-44
Highly thermally conductive low stress underfill adhesive, higher thixotropic version of 122-44
View
102-12A/B
Highly thermally conductive, thermal-cycle resistant black epoxy compound
View
116-03A/B-187
Thermally conductive epoxy adhesive/potting compound
View
122-38A/B-187
Thermally conductive epoxy potting compound
View
128-26
Thermally conductive silicone adhesive and encapsulant
View
904-64
Thermally conductive, addition cured silicone potting compound/adhesive
View
124-41
High temperature thermally conductive adhesive
View
126-41
High temperature, flame resistant thermally conductive adhesive
View
128-04
High temperature microelectronics grade thermally conductive adhesive
View
124-41(UT)
Ultra high temperature thermally conductive adhesive
View
124-19A/B
Room temperature curing, high bond strength
View
124-19A/B2713
Room temperature curing, high bond strength, increased flexibility
View
124-19C119-44
Low temperature curing, high bond strength
View
126-37
B-stageable conductive adhesive with low flow & low CTE
View
112-05
Thermoplastic urethane adhesive
View
126-22
Solvent resistant epoxy adhesive, ideal for LED bonding
View
127-41-25
UV curable pressure sensitive adhesive, ideal for 25µm bond line
View
127-41-50
UV curable pressure sensitive adhesive, ideal for 50µm bond line
View
127-45
Die attach adhesive
View
125-01A/B-187
Snap cure die attach adhesive
View
128-32FP
Fine pitch, B-Stageable epoxy adhesive
View
128-32-25
B-stageable epoxy adhesive, ideal for 25µm bond line
View
128-32-50
B-stageable epoxy adhesive, ideal for 50µm bond line
View
122-44
Silicone, pressure sensitive adhesive
View
122-44(SP)C
Non-flammable silicone, pressure sensitive adhesive
View
124-24
UV curable flexible adhesive
View
124-22C
Solvent resistant, low temperature curing epoxy adhesive
View
121-23
B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate
View
125-22-F
B-Stageable electrically conductive epoxy adhesive film
View
124-33-F
B-Stageable electrically conductive thermoplastic adhesive film
View
118-06-F
B-Stageable die attach electrically conductive epoxy adhesive film
View
126-37-F
B-Stageable anisotropic electrically conductive epoxy adhesive film
View
127-03-F
B-Stageable thermally conductive epoxy adhesive film
View
126-22-F
B-Stageable anisotropic electrically conductive urethane adhesive film
View
124-07-F
B-Stageable electrically insulating epoxy adhesive film
View
122-07-F
B-Stageable thermally conductive epoxy adhesive film
View
114-26B
Ag/AgCl conductive polymer coated film
View
114-26A
Ag/AgCl conductive polymer coated film
View
129-05
Ag/AgCl conductive polymer coated film
View
129-08
Silver/Carbon/Ag/AgCl polymer coated film
View
125-20
Chemically resistant electrode ink
View
126-49(SP)A/B
Elastomeric electrode ink for reference electrodes
View
117-43
Water-borne electrode ink
View
117-43(EU)
Water-borne electrode ink, NMP free
View
113-09
Standard electrode ink for defibrillation and reference electrodes
View
113-09(LPS)
More flexible, solvent resistant version of 113-09
View
113-09(S)
Increased solvent resistant version of 113-09
View
113-09H
Hydrophilic version of 113-09
View
117-23
Standard electrode ink for defibrillation electrodes
View
117-23(S)
Increased solvent resistant version of 117-23
View
124-36
Standard electrode ink
View
125-21
Chemically resistant electrode ink
View
106-12
Standard electrode material for ECG
View
119-10
Electrode ink
View
128-06(PP)
Electrode ink
View
127-11
Electrode ink for ECG electrodes
View
115-02
Electrode ink for ECG electrodes
View
F940A/B
Black, flame-out, epoxy potting and encapsulating compound. Low viscosity, self de-aerating, thermally conductive. Room temperature cure.
View
F940A/B-187
Low viscosity with long pot life. Requires mild heat cure.
View
F947A/B
Room temperature, improved heat resistance. Other properties similar to F940A/B.
View
F947A/B-187
Excellent heat resistance, extended pot life. Requires mild heat cure.
View
102-11A/B
Crack resistant, black, flame-out, epoxy compound. Room temperature cure, improved resistance to thermal cycling. Other properties similar to F947A/B.
View
102-11A/B-187
Excellent resistance to thermal shock, longer pot life. Requires mild heat cure.
View
102-12A/B-187
Same as above, but extended pot life; better resistance to thermal cracking.
View
113-33A/B
Crack resistant, black, flame-out, glob top epoxy. Non sag encapsulant.
View
904-64A/B
Two component, easy air release and low shrinkage addition cured silicone potting compound
View
811-64A/B
Two component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage
View
128-13LVA/B
Room temperature curing silicone encapsulant & sealant
View
116-20
UV flexible curable encapsulant
View
128-16A/B
Room temperature curing urethane adhesive and sealant
View
128-27
Low stress thermally conductive epoxy cationic cured encapsulant
View
124-15
Green flame out epoxy
View
128-15
UV curable pressure sensitive adhesive
View
124-07
B-Stageable laminating adhesive
View
128-19
B-Stageable low CTE laminating adhesive
View
128-29
UV curable pressure sensitive adhesive
View
128-38
B-Stageable hermetic lid attach
View
127-04
B-Stageable laminating adhesive
View
129-03
B-Stageable Hybrid cure adhesive
View
102-32G1
Flexible conductive adhesive, lower resistivity version of 102-32
View
102-32D
Flexible conductive adhesive. Easier to dispense version of 102-32
View
125-19FS
Elastomeric silicone conductive ink,
View
904-64-4
Thermally conductive adhesive
View
105-48
Semi-conductive pressure-sensitive adhesive
View
117-33
High-temperature flexible conductive adhesive
View
127-49
Ultra high temperature conductive ink
View
127-38
Chemically and abrasion resistant conductive ink
View
127-39
Chemically and abrasion resistant conductive ink
View
908-61
Two component gray thermally conductive silicone
View
126-14
Low temperature curing adhesive
View
118-34
B-Stageable, electrically conductive epoxy adhesive with high reflow properties
View
124-08C
Single component version of 124-08A/B
View
GPC-251A/CA-414
Higher bond strength & lower viscosity version of GPC-251A/B
View
122-07
Highly thermally conductive epoxy adhesive, B-Stageable
View
126-32R
Red Jettable epoxy surface mount adhesive
View
126-32B
Blue Jettable epoxy surface mount adhesive
View
126-32Bk
Black Jettable epoxy surface mount adhesive
View
107-02
Reworkable, Environmentally friendly with an odorless solvent. Maintains flexibility at very low temperatures.
View
119-12
Useful in applications where a delay between the application of the adhesive and the final bonding of parts is desired
View
119-05
Prior to curing is designed to remain in a liquid state for up to 5 days without drying out. Excellent bonding to rigid circuitry.
View
120-02
Flexible, Medium Viscosity Electrically Conductive Adhesive
View
110-16
Flexible, Low Viscosity Electrically Conductive Adhesive
View
124-07HV
Higher viscosity version of 124-07
View
122-47
Die attach polyimide electrically conductive adhesive
View
Electraset 620
Die Attach grade conductive epoxy/adhesive for high throughput applications
View
Electraset 620-2
Die Attach grade conductive epoxy/adhesive with excellent thermal cycle properties
View
Electraset 620-3
Die Attach grade conductive epoxy/adhesive with highest thermal conductivity
View
Electraset 620-4
Die Attach grade conductive epoxy/adhesive with no bleed on gold contacts
View
127-12
Die attach grade thermally conductive epoxy adhesive
View
127-15(SD)
Thermally conductive flexible die attach epoxy adhesive
View
110-16(P)
Electrically conductive coating for tantalum capacitors and ceramic surfaces
View
123-36
Electrically conductive coating
View
125-24
Sprayable, room temperature curing coating coating for use on plastic housings.
View
126-43
Solvent resistant electrically conductive ink
View
128-22
Solvent resistant electrically conductive ink that spontaneously self nucleates.
View
110-16i
Solvent resistant electrically conductive ink that spontaneously self nucleates.
View
116-48
Higher viscosity version of 110-16i
View
115-28
Higher viscosity version of 116-48
View
117-31i
Solvent resistant electrically conductive ink that spontaneously self nucleates.
View
121-21
Solvent resistant electrically conductive ink that spontaneously self nucleates.
View
121-25
Electrically conductive ink/coating
View
127-16
Electrically conductive ink/coating
View
102-05F
Electrically conductive, flexible ink for use on Kapton® (polyimide) and Mylar® (polyester) flex circuits
View
117-48
Electrically conductive modified epoxy/ink for printing narrow lines onto three dimensional and flat surfaces
View
118-29
Waterborne electrically conductive coating for Low V.O.C. applications.
View
124-47
Electrically conductive silicone ink for use on hard to stick to surfaces
View
GPC-251 A/B
Two-part room temperature curing silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices.
View
GPC-352-1A/B-187
Low Temperature, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.
View
GPC-352-1A/B119-44
Long pot life, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.
View
121-20A/B
Two-component low temperature curing silver filled epoxy adhesive exhibiting conductive only in the z-axis.
View
120-27A/B-187
Black low viscosity two-component underfill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface
View
123-38A/B-187
Low-viscosity two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity.
View
127-01A/B119-44
Electrically conductive epoxy/ink for bus-bar and traces, ideal for polycarbonate substrates
View
125-13HV
Fine line printable, 3 to 4 mil widths and spaces, high viscosity
View
108-06
UV curable conductive ink
View
124-50
Resistive conductive ink ideal for urethane and polycarbonate substrates
View
127-24PG
Highly flexible green dielectric.
View
124-33
Extremely flexible conductive adhesive
View
118-09C
Ready to print, precatalyzed and frozen version of 118-09A/B119-44
View
128-18A/B119-44
Fine line solvent resistant low temperature curing, flexible conductive epoxy ink for ITO/TCO coated substrates
View
120-07
Fast curing, thermoplastic conductive ink for ITO/TCO coated substrates
View
129-15
Electrically conductive ink suitable for OPV modules
View
GPC 251A/B
Two part, room temperature curing conductive adhesive
View
122-30
Ceramic filled thermoplastic adhesive suitable for low energy substrates with spacer beads
View
117-38
One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device
View
118-26
One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device
View
118-27
One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device
View
117-49
B-stageable, thermally conductive coating and adhesive
View
122-29
Low stress, thermally conductive epoxy adhesive
View
121-47
Electrically conductive/thermally conductive via filling paste.
View
127-48
Solvent resistant washable conductive ink
View
906-57A/B
Room temperature curing two component urethane encapsulant
View
128-39
Dielectric adhesive and coating
View
129-14(LR)
Low resistance fast curing epoxy ink, designed for polycarbonate substrates
View
129-14(MR)
Moderate resistance fast curing epoxy ink, designed for polycarbonate substrates
View
129-14(HR)
High resistance fast curing epoxy ink, designed for polycarbonate substrates
View
124-18
Translucent white, adheres ITO or and polycarbonate
View
118-38
Water-borne conductive ink
View
124-34A/B-187
Snap cure electrically conductive epoxy adhesive
View
114-34A/B
Electrically resistive ink ideal for ITO substrates
View
124-31
Translucent conductive ink
View
128-45
Flexible Phosphor ink
View
128-50LPW
Flexible Phosphor ink
View
128-50LPE
Flexible Phosphor ink
View
128-49
Dielectric ink
View
123-34
B-Stageable Epoxy Adhesive
View