Data Sheets – Creative Materials

Creative Materials datasheets are available in PDF format for easy printing and viewing. A PDF reader is required to view and print PDF files.

Product	Description
127-07	Elastomeric conductive ink	Silver Inks
112-15A	Standard membrane switch conductive ink.	Silver Inks
125-10	Economical conductive ink.	Silver Inks
125-13	Fine line printable, 3 to 4 mil widths and spaces.	Silver Inks
118-38(EU)	Abrasion resistant, water-based, NMP free	Silver Inks
120-07(LPS)	Electrically conductive for ITO and polycarbonate	Silver Inks
126-33	Abrasion resistant extremely conductive ink	Silver Inks
125-26A/B119-44	Fine line printable, 3 mil line widths, adheres to ITO	Silver Inks
118-09A/B119-44	Low temp curing, adheres to ITO	Silver Inks
126-21C	Economical Conductive ink for ITO	Silver Inks
125-19(SP)C	Elastomeric silicone conductive ink, non-flammable	Silver Inks
118-41	Shielding of polyimide flex circuits. Good for high temperatures.	Silver Inks
125-13HT	Polyimide fine line printable, 3mil line widths, high flexibility	Silver Inks
110-19(UT)	Polyimide ink for very high service temperatures.	Silver Inks
117-31	Plateable conductive ink	Silver Inks
127-20A/B	Low temp curing, adhesion to difficult substrates	Silver Inks
119-21	Abrasion resistant, adheres to ITO	Silver Inks
118-43(LPS)	Extremely flexible electrically conductive ink, ideal for elastomeric and difficult substrates	Silver Inks
124-02	Water based conductive ink.	Silver Inks
125-28	Conductive ink for high speed printing processes.	Silver Inks
110-03	Solvent based conductive ink	Silver Inks
127-10	Low temp curing, adheres to polycarbonate	Silver Inks
125-10ADP	Abrasion resistant economical conductive ink	Economical inks
126-09	Economical conductive ink	Economical inks
125-43C	Economical Conductive ink for ITO	Economical inks
121-30	Carbon/Silver conductive ink	Economical inks
125-46A/B	Economical conductive epoxy adhesive	Economical inks
126-35	Economical high coverage conductive coating	Economical inks
126-45	Economical conductive ink ideal for urethane & vinyl	Economical inks
112-48A	Standard membrane switch resistive ink	Carbon Inks
127-48LR	Washable resistive ink	Carbon Inks
126-48	Resistive conductive ink ideal for printed heaters	Carbon Inks
125-14	High resistance ink, blend-able with 126-48	Carbon Inks
123-18	Extremely resistant ink. Blend-able with 112-48	Carbon Inks
124-50(LPS)	Resistive ink for ITO or and polycarbonate	Carbon Inks
124-39(EU)	Abrasion resistant, water-based, NMP free	Carbon Inks
128-07	Elastomeric resistive ink	Carbon Inks
126-28	Abrasion resistant ink	Carbon Inks
126-03(SP)C	Elastomeric silicone resistive ink, non-flammable	Carbon Inks
114-34	Low temperature curing two component, epoxy ink. Adheres to ITO	Carbon Inks
120-24	High temp epoxy ink, adheres to ITO and polyimide substrates	Carbon Inks
127-06	High resistance ink, blend able with 120-24, ideal for strain gauges	Carbon Inks
121-35(UT)	Polyimide resistive ink for very high service temperatures	Carbon Inks
119-28	Very flexible resistive ink	Carbon Inks
124-43	Water based resistive ink	Carbon Inks
110-04	Solvent based resistive ink	Carbon Inks
127-24	Highly flexible green dielectric.	Dielectric Inks
127-24PB	Highly flexible blue dielectric.	Dielectric Inks
116-20LH	Highly flexible low haze clear dielectric	Dielectric Inks
127-48D	Solvent resistant washable dielectric ink ideal for fabrics	Dielectric Inks
124-18(LPS)	Translucent white, adheres ITO or and polycarbonate	Dielectric Inks
126-26/B-507	Elastomeric silicone dielectric ink	Dielectric Inks
126-26(SP)A/B	Non-Flammable Silicone dielectric ink and coating	Dielectric Inks
128-03A/B-187	Black, flexible epoxy dielectric, adheres to ITO	Dielectric Inks
118-08A/B119-44	Blue, flexible epoxy dielectric, adheres to ITO	Dielectric Inks
118-12A/B119-44	Clear, flexible epoxy dielectric, adheres to ITO	Dielectric Inks
125-50	Opaque White epoxy dielectric, adheres to ITO	Dielectric Inks
128-31	High dielectric constant ink for low temperature substrates	Dielectric Inks
114-14A	High dielectric constant epoxy ink for capacitive layers	Dielectric Inks
122-01(UT)	High service temperature polyimide dielectric	Dielectric Inks
122-01(P)	Polyimide dielectric, high flexibility	Dielectric Inks
118-02	Flexible, epoxy dielectric	Dielectric Inks
119-07	High dielectric strength coating/ink	Dielectric Inks
122-06	High dielectric constant for capacitive layers	Dielectric Inks
111-27	High dielectric strength coating	Dielectric Inks
128-40(S)	Chemically resistant high dielectric constant ink	Dielectric Inks
129-02	Clear, flexible UV curable dielectric for use over shielding conductive inks	Dielectric Inks
129-02(MR)	Clear, moisture resistant flexible UV curable dielectric for use over shielding conductive inks	Dielectric Inks
113-15	Low temperature curing, flexible & highly filled, ideal for polyester	Radio Opaque Inks
125-09	Very flexible, low temperature curing, ideal for urethane	Radio Opaque Inks
125-09PC	Very flexible, low temperature curing, ideal for polycarbonate	Radio Opaque Inks
125-09TS	Very abrasion resistant, thermosetting version of 125-09, ideal for urethane	Radio Opaque Inks
128-08	Very flexible pink radio opaque	Radio Opaque Inks
119-31	Very flexible, low temperature curing, ideal for urethane	Radio Opaque Inks
119-31TS	Very flexible, low temperature curing, ideal for urethane, increased solvent resistance	Radio Opaque Inks
113-49	Flexible, abrasion resistant radio opaque ink	Radio Opaque Inks
114-29A/B	Abrasion resistant, solvent resistant ideal for PEEK and similar substrates	Radio Opaque Inks
124-17	Abrasion resistant, solvent resistant epoxy ink	Radio Opaque Inks
124-35A/B-507	Elastomeric ink with adhesive properties and ideal for silicone substrates	Radio Opaque Inks
124-25	Abrasion resistant, solvent resistant epoxy ink	Radio Opaque Inks
125-09MDB	Very flexible blue radio opaque ink.	Radio Opaque Inks
114-29B A/B	Abrasion resistant, blue, solvent resistant & ideal for PEEK and similar substrates	Radio Opaque Inks
114-29G A/B	Abrasion resistant, green, solvent resistant & ideal for PEEK and similar substrates	Radio Opaque Inks
118-06(SP)	B-stageable conductive adhesive.	Conductive Adhesives
125-22	B-stageable conductive adhesive with low flow & low CTE	Conductive Adhesives
125-22C119-44	Lower temperature curing version of 125-22	Conductive Adhesives
124-33(S)	Extremely flexible conductive adhesive	Conductive Adhesives
118-06(SD)	B-Stageable conductive adhesive	Conductive Adhesives
127-49A/B	Two part, room temperature curing silicone conductive adhesive	Conductive Adhesives
118-15A/B	Two part, long pot life, general purpose conductive adhesive. Available as one component	Conductive Adhesives
805-19C	One component room temperature curing	Conductive Adhesives
128-17A/B	Fast curing, room temperature curing conductive adhesive	Conductive Adhesives
GPC-251A/B	Two part, room temperature curing conductive adhesive	Conductive Adhesives
GPC -251A/CA-414	Two part, room temperature curing conductive adhesive	Conductive Adhesives
122-38(SD)	Ionically clean die attach adhesive	Conductive Adhesives
GPC-251A/B2612	Two part, room temperature, flexible conductive adhesive	Conductive Adhesives
124-08A/B	Two part, long pot life, flexible conductive adhesive	Conductive Adhesives
102-32NFC	High temperature, flexible silicone adhesive, non-flammable	Conductive Adhesives
102-32	High temperature, flexible silicone adhesive.	Conductive Adhesives
102-32RT	High temperature, flexible silicone adhesive, low temperature curing	Conductive Adhesives
126-40	Flexible fine feature epoxy adhesive	Conductive Adhesives
124-08LVC	Single component conductive adhesive.	Conductive Adhesives
128-33	High temperature single component conductive adhesive	Conductive Adhesives
125-19FS/B-507	Elastomeric silicone conductive ink	Elastomeric inks
125-19(SP)A/B	Elastomeric silicone conductive ink, non-flammable	Elastomeric inks
120-07LPS	Flexible/elastomeric conductive ink ideal for urethane substrates	Elastomeric inks
126-03/B-507	Elastomeric carbon silicone resistive ink	Elastomeric inks
126-03(SP)A/B	Elastomeric carbon silicone resistive ink, non-flammable	Elastomeric inks
127-14	Elastomeric dielectric ink	Elastomeric inks
126-26	Elastomeric silicone dielectric ink	Elastomeric inks
126-08	Extremely high thermally conductive epoxy adhesive	Themally Conductive Adhesives
122-07(SP)	Highly thermally conductive epoxy adhesive, B-Stageable	Themally Conductive Adhesives
125-31FPC	Highly thermally conductive epoxy adhesive, B-Stageable, low temperature curing	Themally Conductive Adhesives
127-03	Highly thermally conductive epoxy adhesive, B-Stageable	Themally Conductive Adhesives
109-12	Low stress, high thermally conductive adhesive/potting compound	Themally Conductive Adhesives
125-35C	Highly thermally conductive epoxy adhesive	Themally Conductive Adhesives
127-31	Elastomeric, flexible thermally conductive adhesive/potting compound	Themally Conductive Adhesives
116-04C	Highly thermally conductive epoxy adhesive/potting compound	Themally Conductive Adhesives
122-39(SD)	Ionically clean die attach adhesive	Themally Conductive Adhesives
108-50	Low stress, moderate thermally conductive adhesive/potting compound	Themally Conductive Adhesives
108-50MG	Microelectronics grade, low stress, moderate thermally conductive adhesive/potting compound	Themally Conductive Adhesives
813-04	One component thermally conductive semi-flexible epoxy	Themally Conductive Adhesives
128-21C	Low stress thermally highly thermally conductive epoxy adhesive	Themally Conductive Adhesives
125-35A/B	Highly thermally conductive epoxy adhesive	Themally Conductive Adhesives
125-31A/B	Highly thermally conductive epoxy adhesive, higher viscosity version of 125-35A/B	Themally Conductive Adhesives
116-04A/B-187	Highly thermally conductive epoxy adhesive/potting compound	Themally Conductive Adhesives
810-44-2A/B	Highly thermally conductive epoxy adhesive	Themally Conductive Adhesives
122-24A/B119-44	Highly thermally conductive low stress underfill adhesive	Themally Conductive Adhesives
122-31A/B119-44	Highly thermally conductive low stress underfill adhesive, higher thixotropic version of 122-44	Themally Conductive Adhesives
102-12A/B	Highly thermally conductive, thermal-cycle resistant black epoxy compound	Themally Conductive Adhesives
116-03A/B-187	Thermally conductive epoxy adhesive/potting compound	Themally Conductive Adhesives
122-38A/B-187	Thermally conductive epoxy potting compound	Themally Conductive Adhesives
128-26	Thermally conductive silicone adhesive and encapsulant	Themally Conductive Adhesives
904-64	Thermally conductive, addition cured silicone potting compound/adhesive	Themally Conductive Adhesives
124-41	High temperature thermally conductive adhesive	Themally Conductive Adhesives
126-41	High temperature, flame resistant thermally conductive adhesive	Themally Conductive Adhesives
128-04	High temperature microelectronics grade thermally conductive adhesive	Themally Conductive Adhesives
124-41(UT)	Ultra high temperature thermally conductive adhesive	Themally Conductive Adhesives
124-19A/B	Room temperature curing, high bond strength	Anisotropic Adhesives
124-19A/B2713	Room temperature curing, high bond strength, increased flexibility	Anisotropic Adhesives
124-19C119-44	Low temperature curing, high bond strength	Anisotropic Adhesives
126-37	B-stageable conductive adhesive with low flow & low CTE	Anisotropic Adhesives
112-05	Thermoplastic urethane adhesive	Anisotropic Adhesives
126-22	Solvent resistant epoxy adhesive, ideal for LED bonding	Anisotropic Adhesives
127-41-25	UV curable pressure sensitive adhesive, ideal for 25µm bond line	Anisotropic Adhesives
127-41-50	UV curable pressure sensitive adhesive, ideal for 50µm bond line	Anisotropic Adhesives
127-45	Die attach adhesive	Anisotropic Adhesives
125-01A/B-187	Snap cure die attach adhesive	Anisotropic Adhesives
128-32FP	Fine pitch, B-Stageable epoxy adhesive	Anisotropic Adhesives
128-32-25	B-stageable epoxy adhesive, ideal for 25µm bond line	Anisotropic Adhesives
128-32-50	B-stageable epoxy adhesive, ideal for 50µm bond line	Anisotropic Adhesives
122-44	Silicone, pressure sensitive adhesive	Anisotropic Adhesives
122-44(SP)C	Non-flammable silicone, pressure sensitive adhesive	Anisotropic Adhesives
124-24	UV curable flexible adhesive	Anisotropic Adhesives
124-22C	Solvent resistant, low temperature curing epoxy adhesive	Anisotropic Adhesives
121-23	B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate	Anisotropic Adhesives
125-22-F	B-Stageable electrically conductive epoxy adhesive film	Films
124-33-F	B-Stageable electrically conductive thermoplastic adhesive film	Films
118-06-F	B-Stageable die attach electrically conductive epoxy adhesive film	Films
126-37-F	B-Stageable anisotropic electrically conductive epoxy adhesive film	Films
127-03-F	B-Stageable thermally conductive epoxy adhesive film	Films
126-22-F	B-Stageable anisotropic electrically conductive urethane adhesive film	Films
124-07-F	B-Stageable electrically insulating epoxy adhesive film	Films
122-07-F	B-Stageable thermally conductive epoxy adhesive film	Films
114-26B	Ag/AgCl conductive polymer coated film	Films
114-26A	Ag/AgCl conductive polymer coated film	Films
129-05	Ag/AgCl conductive polymer coated film	Films
129-08	Silver/Carbon/Ag/AgCl polymer coated film	Films
125-20	Chemically resistant electrode ink	Silver-Silver Chloride inks
126-49(SP)A/B	Elastomeric electrode ink for reference electrodes	Silver-Silver Chloride inks
117-43	Water-borne electrode ink	Silver-Silver Chloride inks
117-43(EU)	Water-borne electrode ink, NMP free	Silver-Silver Chloride inks
113-09	Standard electrode ink for defibrillation and reference electrodes	Silver-Silver Chloride inks
113-09(LPS)	More flexible, solvent resistant version of 113-09	Silver-Silver Chloride inks
113-09(S)	Increased solvent resistant version of 113-09	Silver-Silver Chloride inks
113-09H	Hydrophilic version of 113-09	Silver-Silver Chloride inks
117-23	Standard electrode ink for defibrillation electrodes	Silver-Silver Chloride inks
117-23(S)	Increased solvent resistant version of 117-23	Silver-Silver Chloride inks
124-36	Standard electrode ink	Silver-Silver Chloride inks
125-21	Chemically resistant electrode ink	Silver-Silver Chloride inks
106-12	Standard electrode material for ECG	Silver-Silver Chloride inks
119-10	Electrode ink	Silver-Silver Chloride inks
128-06(PP)	Electrode ink	Silver-Silver Chloride inks
127-11	Electrode ink for ECG electrodes	Silver-Silver Chloride inks
115-02	Electrode ink for ECG electrodes	Silver-Silver Chloride inks
F940A/B	Black, flame-out, epoxy potting and encapsulating compound. Low viscosity, self de-aerating, thermally conductive. Room temperature cure.	Potting Compounds & Encapsulant
F940A/B-187	Low viscosity with long pot life. Requires mild heat cure.	Potting Compounds & Encapsulant
F947A/B	Room temperature, improved heat resistance. Other properties similar to F940A/B.	Potting Compounds & Encapsulant
F947A/B-187	Excellent heat resistance, extended pot life. Requires mild heat cure.	Potting Compounds & Encapsulant
102-11A/B	Crack resistant, black, flame-out, epoxy compound. Room temperature cure, improved resistance to thermal cycling. Other properties similar to F947A/B.	Potting Compounds & Encapsulant
102-11A/B-187	Excellent resistance to thermal shock, longer pot life. Requires mild heat cure.	Potting Compounds & Encapsulant
102-12A/B-187	Same as above, but extended pot life; better resistance to thermal cracking.	Potting Compounds & Encapsulant
113-33A/B	Crack resistant, black, flame-out, glob top epoxy. Non sag encapsulant.	Potting Compounds & Encapsulant
904-64A/B	Two component, easy air release and low shrinkage addition cured silicone potting compound	Potting Compounds & Encapsulant
811-64A/B	Two component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage	Potting Compounds & Encapsulant
128-13LVA/B	Room temperature curing silicone encapsulant & sealant	Potting Compounds & Encapsulant
116-20	UV flexible curable encapsulant	Potting Compounds & Encapsulant
128-16A/B	Room temperature curing urethane adhesive and sealant	Potting Compounds & Encapsulant
128-27	Low stress thermally conductive epoxy cationic cured encapsulant	Potting Compounds & Encapsulant
124-15	Green flame out epoxy	Potting Compounds & Encapsulant
128-15	UV curable pressure sensitive adhesive	Printable Adhesives
124-07	B-Stageable laminating adhesive	Printable Adhesives
128-19	B-Stageable low CTE laminating adhesive	Printable Adhesives
128-29	UV curable pressure sensitive adhesive	Printable Adhesives
128-38	B-Stageable hermetic lid attach	Printable Adhesives
127-04	B-Stageable laminating adhesive	Printable Adhesives
129-03	B-Stageable Hybrid cure adhesive	Printable Adhesives
102-32G1	Flexible conductive adhesive, lower resistivity version of 102-32	Silicones
102-32D	Flexible conductive adhesive. Easier to dispense version of 102-32	Silicones
125-19FS	Elastomeric silicone conductive ink,	Silicones
904-64-4	Thermally conductive adhesive	Silicones
105-48	Semi-conductive pressure-sensitive adhesive	Silicones
117-33	High-temperature flexible conductive adhesive	Silicones
127-49	Ultra high temperature conductive ink	Silicones
127-38	Chemically and abrasion resistant conductive ink	Silicones
127-39	Chemically and abrasion resistant conductive ink	Silicones
908-61	Two component gray thermally conductive silicone	Silicones
126-14	Low temperature curing adhesive	Bonding Electronic Components
118-34	B-Stageable, electrically conductive epoxy adhesive with high reflow properties	Bonding Electronic Components
124-08C	Single component version of 124-08A/B	Bonding Electronic Components
GPC-251A/CA-414	Higher bond strength & lower viscosity version of GPC-251A/B	Bonding Electronic Components
122-07	Highly thermally conductive epoxy adhesive, B-Stageable	Bonding Electronic Components
126-32R	Red Jettable epoxy surface mount adhesive	Bonding Electronic Components
126-32B	Blue Jettable epoxy surface mount adhesive	Bonding Electronic Components
126-32Bk	Black Jettable epoxy surface mount adhesive	Bonding Electronic Components
107-02	Reworkable, Environmentally friendly with an odorless solvent. Maintains flexibility at very low temperatures.	Surface Mount Attachment
119-12	Useful in applications where a delay between the application of the adhesive and the final bonding of parts is desired	Surface Mount Attachment
119-05	Prior to curing is designed to remain in a liquid state for up to 5 days without drying out. Excellent bonding to rigid circuitry.	Surface Mount Attachment
120-02	Flexible, Medium Viscosity Electrically Conductive Adhesive	Crystal Oscillators
110-16	Flexible, Low Viscosity Electrically Conductive Adhesive	Crystal Oscillators
124-07HV	Higher viscosity version of 124-07	Crystal Oscillators
122-47	Die attach polyimide electrically conductive adhesive	Die Attachment
Electraset 620	Die Attach grade conductive epoxy/adhesive for high throughput applications	Die Attachment
Electraset 620-2	Die Attach grade conductive epoxy/adhesive with excellent thermal cycle properties	Die Attachment
Electraset 620-3	Die Attach grade conductive epoxy/adhesive with highest thermal conductivity	Die Attachment
Electraset 620-4	Die Attach grade conductive epoxy/adhesive with no bleed on gold contacts	Die Attachment
127-12	Die attach grade thermally conductive epoxy adhesive	Die Attachment
127-15(SD)	Thermally conductive flexible die attach epoxy adhesive	Die Attachment
110-16(P)	Electrically conductive coating for tantalum capacitors and ceramic surfaces	Electroplating
123-36	Electrically conductive coating	Electroplating
125-24	Sprayable, room temperature curing coating coating for use on plastic housings.	Electroplating
126-43	Solvent resistant electrically conductive ink	Electroplating
128-22	Solvent resistant electrically conductive ink that spontaneously self nucleates.	Electroplating
110-16i	Solvent resistant electrically conductive ink that spontaneously self nucleates.	Electroplating
116-48	Higher viscosity version of 110-16i	Electroplating
115-28	Higher viscosity version of 116-48	Electroplating
117-31i	Solvent resistant electrically conductive ink that spontaneously self nucleates.	Electroplating
121-21	Solvent resistant electrically conductive ink that spontaneously self nucleates.	Electroplating
121-25	Electrically conductive ink/coating	Electroplating
127-16	Electrically conductive ink/coating	Electroplating
102-05F	Electrically conductive, flexible ink for use on Kapton® (polyimide) and Mylar® (polyester) flex circuits	EMI-RFI
117-48	Electrically conductive modified epoxy/ink for printing narrow lines onto three dimensional and flat surfaces	EMI-RFI
118-29	Waterborne electrically conductive coating for Low V.O.C. applications.	EMI-RFI
124-47	Electrically conductive silicone ink for use on hard to stick to surfaces	EMI-RFI
GPC-251 A/B	Two-part room temperature curing silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices.	Flip Chip
GPC-352-1A/B-187	Low Temperature, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.	Flip Chip
GPC-352-1A/B119-44	Long pot life, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.	Flip Chip
121-20A/B	Two-component low temperature curing silver filled epoxy adhesive exhibiting conductive only in the z-axis.	Flip Chip
120-27A/B-187	Black low viscosity two-component underfill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface	Flip Chip
123-38A/B-187	Low-viscosity two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity.	Flip Chip
127-01A/B119-44	Electrically conductive epoxy/ink for bus-bar and traces, ideal for polycarbonate substrates	LED Lighting
125-13HV	Fine line printable, 3 to 4 mil widths and spaces, high viscosity	Membrane Switch
108-06	UV curable conductive ink	Membrane Switch
124-50	Resistive conductive ink ideal for urethane and polycarbonate substrates	Membrane Switch
127-24PG	Highly flexible green dielectric.	Membrane Switch
124-33	Extremely flexible conductive adhesive	Membrane Switch
118-09C	Ready to print, precatalyzed and frozen version of 118-09A/B119-44	Solar Cells
128-18A/B119-44	Fine line solvent resistant low temperature curing, flexible conductive epoxy ink for ITO/TCO coated substrates	Solar Cells
120-07	Fast curing, thermoplastic conductive ink for ITO/TCO coated substrates	Solar Cells
129-15	Electrically conductive ink suitable for OPV modules	Solar Cells
GPC 251A/B	Two part, room temperature curing conductive adhesive	Solar Cells
122-30	Ceramic filled thermoplastic adhesive suitable for low energy substrates with spacer beads	Solar Cells
117-38	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device	Solder Masks
118-26	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device	Solder Masks
118-27	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device	Solder Masks
117-49	B-stageable, thermally conductive coating and adhesive	Thermal Management
122-29	Low stress, thermally conductive epoxy adhesive	Thermal Management
121-47	Electrically conductive/thermally conductive via filling paste.	Thermal Management
127-48	Solvent resistant washable conductive ink	Wearable Electronics
906-57A/B	Room temperature curing two component urethane encapsulant	Wearable Electronics
128-39	Dielectric adhesive and coating	Heat Transfer
129-14(LR)	Low resistance fast curing epoxy ink, designed for polycarbonate substrates	Flexible Heaters
129-14(MR)	Moderate resistance fast curing epoxy ink, designed for polycarbonate substrates	Flexible Heaters
129-14(HR)	High resistance fast curing epoxy ink, designed for polycarbonate substrates	Flexible Heaters
124-18	Translucent white, adheres ITO or and polycarbonate	Flexible Heaters
118-38	Water-borne conductive ink	RFID antennas
124-34A/B-187	Snap cure electrically conductive epoxy adhesive	RFID antennas
114-34A/B	Electrically resistive ink ideal for ITO substrates	Electroluminescence (EL)
124-31	Translucent conductive ink	Electroluminescence (EL)
128-45	Flexible Phosphor ink	Electroluminescence (EL)
128-50LPW	Flexible Phosphor ink	Electroluminescence (EL)
128-50LPE	Flexible Phosphor ink	Electroluminescence (EL)
128-49	Dielectric ink	Electroluminescence (EL)
123-34	B-Stageable Epoxy Adhesive	Printable Adhesives

Latest News