Bonding Electronic Components

Creative Materials develops, manufactures and markets specialty chemical products to customers worldwide.
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Creative Materials manufactures superior products for electronic component bonding, which offer features that ensure consistency, reliability, versatility and ease of use. These products are silver-filled, one- and two-part systems with excellent conductivity and are less sensitive to handling and ambient conditions. Several of these products offer custom features, including one-to-one mix ratio (124-08A/B), room temperature cure (GPC 251A/B), B-stageable (118-06, 118-34), and pre-catalyzed single-component product (124-08C).

Multiple packaging options include the popular 5-gram GPC-251A/B bipak, which is pre-measured and ready to use. 124-08C is designed for syringe or jet dispensing. With excellent thermal stability, high-temperature performance, and flexibility, both 118-34 and 118-06 offer the ease of a one-part epoxy system and the versatility of B-stageable product.

Electrically Conductive Adhesives
Product Description Application Method Conductivity Modulus Bond area Pot Life
126-40 Flexible fine feature epoxy adhesive Screen-print/Syringe dispense 0.000025Ω-cm High Small Latent
126-14 Low temperature curing adhesive Syringe dispense 0.00005Ω-cm Low Small Latent
118-34 B-Stageable, electrically conductive epoxy adhesive with high reflow properties Screen-print 0.0002Ω-cm High Any Latent
118-06(SP) B-Stageable, electrically conductive epoxy adhesive with moderate reflow properties Screen-print 0.0002Ω-cm High Any Latent
122-38(SD) Ionically clean die attach adhesive Syringe dispense 0.0002Ω-cm High Any Latent
124-08A/B Two Part, thermal shock resistant, electrically conductive epoxy adhesive Syringe dispense 0.0004Ω-cm High / Moderate Small / Medium 4 days
124-08C Single component version of 124-08A/B Syringe dispense 0.0004Ω-cm High / Moderate Small / Medium 4 days
102-32G1 Flexible conductive adhesive, lower resistivity version of 102-32 Syringe dispense 0.001Ω–cm Low Small Latent
125-22 B-Stageable, electrically conductive epoxy adhesive with low reflow properties Screen-print 0.001Ω-cm High Any Latent
GPC-251A/B Two Part, room temperature curing, electrically conductive epoxy adhesive Syringe dispense 0.005Ω-cm High Any 60 minutes
GPC-251A/CA-414 Higher bond strength & lower viscosity version of GPC-251A/B Syringe dispense 0.005Ω-cm High Any 90 minutes
Thermally Conductive Adhesives
Product Description Application Method Conductivity Modulus Bond area Pot Life
122-07 Highly thermally conductive epoxy adhesive, B-Stageable Screen-print 5.5W/mK High Any Latent
122-39(SD) Ionically clean die attach adhesive Syringe dispense 3.5W/mK High Any Latent
127-31 Elastomeric, flexible thermally conductive adhesive/potting compound Syringe dispense 3.0W/mK Low Any Latent
Staking Compounds
Product Description Application Method Conductivity Modulus Bond area Pot Life
126-32R Red Jettable epoxy surface mount adhesive Jet Dispense n/a High Any 3 days
126-32B Blue Jettable epoxy surface mount adhesive Jet Dispense n/a High Any 4 days
126-32Bk Black Jettable epoxy surface mount adhesive Jet Dispense n/a High Any 5 days
124-07 B-Stageable laminating epoxy adhesive Screen-print n/a High Any Latent
113-33A/B Crack resistant, black, flame-out epoxy Syringe dispense n/a High Any 30 minutes