Surface Mount Attachment

Creative Materials, an ISO 9001 and ISO 14001 certified company, develops, manufactures and markets specialty chemical products to customers worldwide.
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Creative Materials offers adhesives and adhesive films for surface mount attachment of components to printed circuit boards. The end user has a choice of adhesives that can be applied by stenciling, screen printing or syringe dispensing onto either rigid or flexible surfaces, or adhesive films that are suitable for use on a variety of substrates and application constraints. These adhesives offer characteristics that include re-workability, long pot life, and a range of curing temperatures. Surface-mounted components appear in a number of electronic products, including cell phones, laptops, pagers and camcorders.

Creative Materials has recently developed two new products that address different surface mount challenges. Our flexible GPC-251A/B26112 is a high bond strength epoxy with one-to-one mix ratio, offering the convenience of a room-temperature curing product with the versatility of a flexible and resilient bonding agent. Our 102-32D adhesive is extremely effective in applications using stress-sensitive substrates and offers improved ease of handling in production environments that are fast-paced and require more compliant product characteristics.

Product Description Conductivity Modulus Application Method
102-32 Silicone pressure sensitive adhesive. Exhibits overall balance of peel strength, cohesion, lap shear strength and high temperature holding power 0.001Ω-cm Low Syringe Dispense
102-32D Silicone pressure sensitive adhesive. Exhibits overall balance of peel strength, cohesion, lap shear strength and high temperature holding power 0.001Ω-cm Low Syringe Dispense
107-02 Reworkable, Environmentally friendly with an odorless solvent. Maintains flexibility at very low temperatures. 0.001Ω-cm Low Screen-print
118-15A/B Easy to use 1 to 1 mix ratio. Pot life < 4 days. Excellent bonding to rigid circuitry. 0.0001Ω-cm High Syringe Dispense
119-12 Useful in applications where a delay between the application of the adhesive and the final bonding of parts is desired 0.0008Ω-cm High Syringe Dispense
119-05 Prior to curing is designed to remain in a liquid state for up to 5 days without drying out. Excellent bonding to rigid circuitry. 0.00015Ω-cm High Syringe Dispense/Stencil
124-08C One component, 80°C curing. 0.0002Ω-cm Moderate Syringe Dispense
GPC-251A/B2612 Two part, room temperature, flexible conductive adhesive. 0.0002 Ω-cm Moderate Syringe Dispense