An increasing number of applications call for thermally conductive adhesives, in part due to significant heat generation by modern electronics components. Creative Materials’ standard and custom formulations of thermally conductive adhesives feature outstanding thermal stability, chemical resistance, and high temperature properties. Our recent innovations include a flexible pre-catalyzed 100-percent solids epoxy adhesive, featuring high thermal conductivity, chemical resistance and elevated temperature properties.
Creative Materials’ thermally conductive adhesives include one-part and two-part epoxy systems, as well as silicone and polyimide systems. Formulated for use in the manufacture of computer components and LEDs, our thermally conductive adhesives include highly effective thermal epoxies designed to bond a heat-producing component to a heat-sink. Additional applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment, heat-sink bonding, and bonding substrates with dissimilar coefficients of thermal expansion. We engineer our low-viscosity thermally conductive epoxy potting and encapsulating compounds to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface.