Thermally Conductive Adhesives

Creative Materials, an ISO 9001 and ISO 14001 certified company, develops, manufactures and markets specialty chemical products to customers worldwide.
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An increasing number of applications call for thermally conductive adhesives, in part due to significant heat generation by modern electronics components. Creative Materials’ standard and custom formulations of thermally conductive adhesives feature outstanding thermal stability, chemical resistance, and high temperature properties. Our recent innovations include a flexible pre-catalyzed 100-percent solids epoxy adhesive, featuring high thermal conductivity, chemical resistance and elevated temperature properties.

Creative Materials’ thermally conductive adhesives include one-part and two-part epoxy systems, as well as silicone and polyimide systems. Formulated for use in the manufacture of computer components and LEDs, our thermally conductive adhesives include highly effective thermal epoxies designed to bond a heat-producing component to a heat-sink. Additional applications include die attachment, printed circuit board fabrication, advanced material composites, LED attachment, heat-sink bonding, and bonding substrates with dissimilar coefficients of thermal expansion. We engineer our low-viscosity thermally conductive epoxy potting and encapsulating compounds to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface.

1 Part Epoxy Resin Systems
Product Description Application method Thermal Conductivity Modulus Pot life
126-08 Extremely high thermally conductive epoxy adhesive Screen-print 6.6W/mK High Latent
122-07(SP) Highly thermally conductive epoxy adhesive, B-Stageable Screen-print 5.5W/mK High Latent
125-31FPC Highly thermally conductive epoxy adhesive, B-Stageable, low temperature curing Syringe dispense 5.5W/mK Moderate 4 days
127-03 Highly thermally conductive epoxy adhesive, B-Stageable Screen-print 4.3W/mK Moderate Latent
109-12 Low stress, high thermally conductive adhesive/potting compound Syringe dispense 5.5W/mK High/Moderate Latent
125-35C Highly thermally conductive epoxy adhesive Syringe dispense 5.5W/mK High/Moderate 4 days
127-31 Elastomeric, flexible thermally conductive adhesive/potting compound Syringe dispense 3.0W/mK Low Latent
116-04C Highly thermally conductive epoxy adhesive/potting compound Syringe dispense 2.63W/wK High 4 days
122-39(SD) Ionically clean die attach adhesive Syringe dispense 2.1W/mK High Latent
108-50 Low stress, moderate thermally conductive adhesive/potting compound Syringe dispense 1.83W/mK High/Moderate Latent
108-50MG Microelectronics grade, low stress, moderate thermally conductive adhesive/potting compound Syringe dispense 1.83W/mK High/Moderate Latent
813-04 One component thermally conductive semi-flexible epoxy Syringe dispense 0.2W/mK Moderate/Low Latent
128-21C Low stress thermally highly thermally conductive epoxy adhesive Jet dispense 3.1W/mK High/Moderate 4 days
2 Part Epoxy Resin Systems
Product Description Application method Thermal Conductivity Modulus Pot life
125-35A/B Highly thermally conductive epoxy adhesive Syringe dispense 5.5W/mK High/Moderate 4 days
125-31A/B Highly thermally conductive epoxy adhesive, higher viscosity version of 125-35A/B Syringe dispense 5.5W/mK High/Moderate 4 days
116-04A/B-187 Highly thermally conductive epoxy adhesive/potting compound Syringe dispense 2.63W/mK High 4 hours
810-44-2A/B Highly thermally conductive epoxy adhesive Syringe dispense 2.53W/mK High 48 hours
122-24A/B119-44 Highly thermally conductive low stress underfill adhesive Syringe dispense 2.35W/mK High/Moderate 4 days
122-31A/B119-44 Highly thermally conductive low stress underfill adhesive, higher thixotropic version of 122-44 Syringe dispense 2.35W/mK High/Moderate 4 days
102-12A/B Highly thermally conductive, thermal-cycle resistant black epoxy compound Syringe dispense 2.30W/mK High 30 min.
116-03A/B-187 Thermally conductive epoxy adhesive/potting compound Syringe dispense 1.73W/mK High 4 hours
122-38A/B-187 Thermally conductive epoxy potting compound Syringe dispense 1.34W/mK High 4 hours
Silicone resin systems
Product Description Application method Thermal Conductivity Modulus Pot life
128-26 Thermally conductive silicone adhesive and encapsulant Syringe dispense 3.4W/mK Low/Moderate Latent
904-64 Thermally conductive, addition cured silicone potting compound/adhesive Syringe dispense 0.14W/mK Low/Moderate 4 days
Polyimide Resin Systems
Product Description Application method Thermal Conductivity Modulus Pot life
124-41 High temperature thermally conductive adhesive Screen-print 4-5W/mK High Latent
126-41 High temperature, flame resistant thermally conductive adhesive Screen-print 2.96W/mK High Latent
128-04 High temperature microelectronics grade thermally conductive adhesive Screen-print 1.55W/mK High Latent
 124-41(UT) Ultra high temperature thermally conductive adhesive Screen-print 5.0W/mK Extreme Latent

*Typical cure listed. Please refer to technical data sheet or technical support staff for further curing parameters.

Typical Characteristics of Thermally Conductive Adhesives

Advanced material composites
Die attachment
Encapsulating
Epoxy potting
IC packaging
Printed circuit board fabrication
Sealing & high performance coatings

Aluminum
Ceramic
Gold
Copper
FR-4 board

Pad print
Syringe dispense
Screen print
Stencil

Epoxy
Flexible epoxy
Silicone
Polyimide