Thermal management has become increasingly important in modern electronics design as electronic components generate a significant amount of heat – CPUs, power diodes, power transistors are some examples, as is LED lighting.
The properties of 109-12 are ideal for most thermal management applications. This product has low viscosity, reducing air entrapment and allowing for minimal product application, which keeps thermal resistance low. 109-12 is one-component low-stress epoxy, with low shrinkage during curing, and exceptional resistance to thermal-cycling. Similar products are 108-50, 111-17 and 125-31C. Creative Materials’ 122-07(SP) features excellent thermal stability, outstanding chemical resistance and excellent high temperature properties. The thermal cure cycle produces cross-linked, void free bonds. Another effective thermal management product is 122-39(SD), a syringe-dispensable, 100% solids, thermally conductive, electrically insulating, one-component, epoxy adhesive, featuring excellent thermal stability, outstanding chemical resistance and excellent high temperature properties.