Anisotropic Adhesives

Creative Materials, an ISO 9001 and ISO 14001 certified company, develops, manufactures and markets specialty chemical products to customers worldwide.
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Anisotropic conductive adhesives, commonly know as “Z-axis” adhesives, are conductive in the Z-axis and are non-conductive in the X- and Y-axis. Creative Materials’ recent innovations include lower-temperature and faster curing methods, which increase the potential breadth of anisotropic conductive adhesive applications and facilitate faster manufacturing and assembly through-put and overall lower cost. Our standard and custom formulations of anisotropic adhesives meet the specific requirements of a wide-range of applications and are extremely useful in electronic designs where high signal density is required in a small package. Critical in applications where electrical shorts between closely spaced contacts are a concern, applications for anisotropic conductive adhesives include conductive splicing of ribbon cables, PTF circuits, electrical attachment of surface mounted devices, LCD manufacturing, and RFID antenna assembly.

Suitable for application by stenciling, screen-printing, and syringe dispensing, Creative Materials’ anisotropic conductive adhesives products feature excellent adhesion to Kapton, Mylar, glass, polycarbonate, steel and a variety of other substrates, as well as bonding to rubber. Unlike conventional conductive materials, anisotropic conductive adhesives are very resistant to heat and thermocycling, provide superior conductivity, and are less sensitive to handling and extremes of ambient conditions. In addition, they are resistant to chemicals, scratching and creasing.

Product Description Application Method Temperature Stability Pitch (Pad Size & Spacing) Resin Type Minimum Cure Temperature
124-19A/B Room temperature curing, high bond strength Syringe/Hand Apply Moderate Medium Epoxy 25°C
124-19A/B2713 Room temperature curing, high bond strength, increased flexibility Syringe/Hand Apply Moderate Medium Epoxy 25°C
124-19C119-44 Low temperature curing, high bond strength Syringe High Medium Epoxy 100°C
126-37 B-stageable conductive adhesive with low flow & low CTE Screen-print High Medium Epoxy 125°C
112-05 Thermoplastic urethane adhesive Screen-print Low Medium Urethane 80°C
126-22 Solvent resistant epoxy adhesive, ideal for LED bonding Screen-print Moderate Medium Urethane 110°C
127-41-25 UV curable pressure sensitive adhesive, ideal for 25µm bond line Screen-print Low Medium Acrylate UV
127-41-50 UV curable pressure sensitive adhesive, ideal for 50µm bond line Screen-print Low Large Acrylate UV
127-45 Die attach adhesive Syringe High Small Epoxy 100°C
125-01A/B-187 Snap cure die attach adhesive Syringe High Medium Epoxy 100°C
128-32FP Fine pitch, B-Stageable epoxy adhesive Screen-print High Small Epoxy 80°C
128-32-25 B-stageable epoxy adhesive, ideal for 25µm bond line Screen-print High Medium Epoxy 80°C
128-32-50 B-stageable epoxy adhesive, ideal for 50µm bond line Screen-print High Large Epoxy 80°C
122-44 Silicone, pressure sensitive adhesive Screen-print High Medium Silicone 50°C
122-44(SP)C Non-flammable silicone, pressure sensitive adhesive Screen-print High Medium Silicone 100°C
124-24 UV curable flexible adhesive Screen-print Low Medium Acrylate UV
124-22C Solvent resistant, low temperature curing epoxy adhesive Screen-print High Medium Epoxy 100°C
121-23 B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate Screen-print High Medium Epoxy 125°C

Typical Characteristics of Anisotropic Adhesives

Ribbon cable splicing
Flex circuit attachment
Die attachment
LED mounting
Smart card chip attachment

ITO
FR4
Kapton
Mylar
Glass
Polyester
Metalized contact pads
Polycarbonate
Gold

Stamping
Syringe dispense
Screen print
Stencil

Epoxy
Flexible Epoxy
UV Curing
Thermoplastic