Surface Mount Attachment

Creative Materials offers adhesives and adhesive films for surface mount attachment of components to printed circuit boards. The end user has a choice of adhesives that can be applied by stenciling, screen printing or syringe dispensing onto either rigid or flexible surfaces, or adhesive films that are suitable for use on a variety of substrates and application constraints. These adhesives offer characteristics that include re-workability, long pot life, and a range of curing temperatures. Surface-mounted components appear in a number of electronic products, including cell phones, laptops, pagers and camcorders.

Creative Materials has recently developed two new products that address different surface mount challenges. Our flexible GPC-251A/B26112 is a high bond strength epoxy with one-to-one mix ratio, offering the convenience of a room-temperature curing product with the versatility of a flexible and resilient bonding agent. Our 102-32D adhesive is extremely effective in applications using stress-sensitive substrates and offers improved ease of handling in production environments that are fast-paced and require more compliant product characteristics.

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Product
Application Method
Description
102-32 Syringe Dispense Silicone pressure-sensitive adhesive. Exhibits overall balance of peel strength, cohesion, lap shear strength and high temperature holding power.
102-32D Syringe Dispense Silicone pressure sensitive adhesive. Exhibits overall balance of peel strength, cohesion, lap shear strength and high temperature holding power.
107-02 Screen-print Reworkable, Environmentally friendly with an odorless solvent. Maintains flexibility at very low temperatures.
118-15 Syringe Dispense Easy to use 1 to 1 mix ratio. Pot life < 4 days. Excellent bonding to rigid circuitry.
119-12 Syringe Dispense Useful in applications whre a delay between the appilcation of the adhesive and the final bonding of parts is desired.
119-05 Syringe Dispense or Stencil Prior to curing, is designed to remain in a liquid state for up to 5 days without drying out. Excellent bonding to rigid circuitry.
124-08C Syringe Dispense One-component, 80°C curing.
GPC-251A/B26112 Syringe Dispense Two part, room temperature, flexible conductive adhesive.

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