Anisotropic Adhesives

Anisotropic conductive adhesives, commonly know as "Z-axis" adhesives, are conductive in the Z-axis and are non-conductive in the X- and Y-axis. Creative Materials' recent innovations include lower-temperature and faster curing methods, which increase the potential breadth of anisotropic conductive adhesive applications and facilitate faster manufacturing and assembly through-put and overall lower cost. Our standard and custom formulations of anisotropic adhesives meet the specific requirements of a wide-range of applications and are extremely useful in electronic designs where high signal density is required in a small package. Critical in applications where electrical shorts between closely spaced contacts are a concern, applications for anisotropic conductive adhesives include conductive splicing of ribbon cables, PTF circuits, electrical attachment of surface mounted devices, LCD manufacturing, and RFID antenna assembly.

Suitable for application by stenciling, screen-printing, and syringe dispensing, Creative Materials' anisotropic conductive adhesives products feature excellent adhesion to Kapton, Mylar, glass, polycarbonate, steel and a variety of other substrates, as well as bonding to rubber. Unlike conventional conductive materials, anisotropic conductive adhesives are very resistant to heat and thermocycling, provide superior conductivity, and are less sensitive to handling and extremes of ambient conditions. In addition, they are resistant to chemicals, scratching and creasing.

Order Sample Technical
Question
Product
Recommendation

Thermoset Resin Systems (Silver Filled)

Product
Form
Application Method
Parts
Flexi-bility
Bond Strength
Chemical Resis-tance
Cure Temp (°C)
Max Operating Temp (°C)
Minimum Contact Spacing
(in)
Comments
115-29 Liquid SP, SD, ST 1 No 2100 psi E 130 275 0.005 Good bond strength
121-20 Paste SD 2 No 2000 psi E 80 200 0.005 Lower temp curing
124-19 Paste SD 2 No 1500 psi E 25 175 0.005 Room temp curing
124-20 B-
stage
able
SP, SD, ST 1 Yes 1500 psi G 150 200 0.005 High temp use
124-21 B-
stage
able
SP, SD, ST 1 Yes 1700 psi G 135 225 0.005 Moderate temp use
124-22C Liquid SP, SD, ST 1 Yes 1800 psi G 80 200 0.005 Lower temp curing
124-22A/B Liquid SP, SD, ST 2 Yes 1800 psi G 80 200 0.005 Lower temp curing
121-23 B-
stage
able
SP, SD, ST 1 Yes 2000 psi E 150 225 0.005 High strength
121-24 Dry
Film
TF 1 Yes 2000 psi E 150 225 0.005 Film
111-28 Paste SD 1 Yes 5-7 pli E 160 260 0.005 Medium viscosity
108-15 Paste SD 1 Yes 5-7 pli E 160 260 0.005 Low viscosity
122-44 Liquid SP 1 Yes 4-6 pli E 160 260 0.005 Screen printable
124-24 Paste SD 1 Yes 3-4 pli G UV 140 0.005 UV curing
117-36 Liquid SP, SD, ST 1 Yes 3-4 pli G UV 120 0.003 UV curing

Thermoset Resin Systems (Nickel Filled)

Product
Form
Application Method
Parts
Flexi-bility
Bond Strength
Chemical Resis-tance
Cure Temp (°C)
Max Operating Temp (°C)
Minimum Contact Spacing
(in)
Comments
120-43 Liquid SP, SD, ST 1 No 2100 psi E 130 275 0.003 Lower cost

Thermoplastic Resin Systems (Silver Filled)

Product
Form
Application Method
Parts
Flexi-bility
Bond Strength
Chemical Resis-tance
Cure Temp (°C)
Max Operating Temp (°C)
Minimum Contact Spacing
(in)
Comments
124-23 Liquid SP, SD, ST 1 Yes 3-4 pli P 100 120 0.005 Soft enough to thermoform
111-29 Liquid SP, SD, ST 1 Yes 3-4 pli F 120 140 0.005 Blend
112-05 Liquid SP 1 Yes 3-4 pli F 175 140 0.005 Screen printable, blend
111-05 Paste SD 1 Yes 3-4 pli F 120 120 0.005 Soft blend
111-21 Liquid SP 1 Yes 3-4 pli F 140 120 0.005 Middle blend
122-12 Liquid SP 1 Yes 3-4 pli F 120 120 0.005 Middle blend
Application method Key: SP= Screen-Print, SD= Syringe Dispense, ST= Stencil, TF=Transfer Film
Resistance to MEK: E=Excellant, G=Good, F-Fair, P=Poor

ISO 9001 ISO 14001 ROHS Reach