Data Sheets – Creative Materials

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Product	Description	Link
127-07	Elastomeric conductive ink
112-15A	Standard membrane switch conductive ink.
125-10	Economical conductive ink.
125-13	Fine line printable, 3 to 4 mil widths and spaces.
118-38(EU)	Abrasion resistant, water-based, NMP free
120-07(LPS)	Electrically conductive for ITO and polycarbonate
126-33	Abrasion resistant extremely conductive ink
125-26A/B119-44	Fine line printable, 3 mil line widths, adheres to ITO
118-09A/B119-44	Low temp curing, adheres to ITO
126-21C	Economical Conductive ink for ITO
125-19(SP)C	Elastomeric silicone conductive ink, non-flammable
118-41	Shielding of polyimide flex circuits. Good for high temperatures.
125-13HT	Polyimide fine line printable, 3mil line widths, high flexibility
110-19(UT)	Polyimide ink for very high service temperatures.
117-31	Plateable conductive ink
127-20A/B	Low temp curing, adhesion to difficult substrates
119-21	Abrasion resistant, adheres to ITO
118-43(LPS)	Extremely flexible electrically conductive ink, ideal for elastomeric and difficult substrates
124-02	Water based conductive ink.
125-28	Conductive ink for high speed printing processes.
110-03	Solvent based conductive ink
127-10	Low temp curing, adheres to polycarbonate
125-10ADP	Abrasion resistant economical conductive ink
126-09	Economical conductive ink
125-43C	Economical Conductive ink for ITO
121-30	Carbon/Silver conductive ink
125-46A/B	Economical conductive epoxy adhesive
126-35	Economical high coverage conductive coating
126-45	Economical conductive ink ideal for urethane & vinyl
112-48A	Standard membrane switch resistive ink
127-48LR	Washable resistive ink
126-48	Resistive conductive ink ideal for printed heaters
125-14	High resistance ink, blend-able with 126-48
123-18	Extremely resistant ink. Blend-able with 112-48
124-50(LPS)	Resistive ink for ITO or and polycarbonate
124-39(EU)	Abrasion resistant, water-based, NMP free
128-07	Elastomeric resistive ink
126-28	Abrasion resistant ink
126-03(SP)C	Elastomeric silicone resistive ink, non-flammable
114-34	Low temperature curing two component, epoxy ink. Adheres to ITO
120-24	High temp epoxy ink, adheres to ITO and polyimide substrates
127-06	High resistance ink, blend able with 120-24, ideal for strain gauges
121-35(UT)	Polyimide resistive ink for very high service temperatures
119-28	Very flexible resistive ink
124-43	Water based resistive ink
110-04	Solvent based resistive ink
127-24	Highly flexible green dielectric.
127-24PB	Highly flexible blue dielectric.
116-20LH	Highly flexible low haze clear dielectric
127-48D	Solvent resistant washable dielectric ink ideal for fabrics
124-18(LPS)	Translucent white, adheres ITO or and polycarbonate
126-26/B-507	Elastomeric silicone dielectric ink
126-26(SP)A/B	Non-Flammable Silicone dielectric ink and coating
128-03A/B-187	Black, flexible epoxy dielectric, adheres to ITO
118-08A/B119-44	Blue, flexible epoxy dielectric, adheres to ITO
118-12A/B119-44	Clear, flexible epoxy dielectric, adheres to ITO
125-50	Opaque White epoxy dielectric, adheres to ITO
128-31	High dielectric constant ink for low temperature substrates
114-14A	High dielectric constant epoxy ink for capacitive layers
122-01(UT)	High service temperature polyimide dielectric
122-01(P)	Polyimide dielectric, high flexibility
118-02	Flexible, epoxy dielectric
119-07	High dielectric strength coating/ink
122-06	High dielectric constant for capacitive layers
111-27	High dielectric strength coating
128-40(S)	Chemically resistant high dielectric constant ink
129-02	Clear, flexible UV curable dielectric for use over shielding conductive inks
129-02(MR)	Clear, moisture resistant flexible UV curable dielectric for use over shielding conductive inks
113-15	Low temperature curing, flexible & highly filled, ideal for polyester
125-09	Very flexible, low temperature curing, ideal for urethane
125-09PC	Very flexible, low temperature curing, ideal for polycarbonate
125-09TS	Very abrasion resistant, thermosetting version of 125-09, ideal for urethane
128-08	Very flexible pink radio opaque
119-31	Very flexible, low temperature curing, ideal for urethane
119-31TS	Very flexible, low temperature curing, ideal for urethane, increased solvent resistance
113-49	Flexible, abrasion resistant radio opaque ink
114-29A/B	Abrasion resistant, solvent resistant ideal for PEEK and similar substrates
124-17	Abrasion resistant, solvent resistant epoxy ink
124-35A/B-507	Elastomeric ink with adhesive properties and ideal for silicone substrates
124-25	Abrasion resistant, solvent resistant epoxy ink
125-09MDB	Very flexible blue radio opaque ink.
114-29B A/B	Abrasion resistant, blue, solvent resistant & ideal for PEEK and similar substrates
114-29G A/B	Abrasion resistant, green, solvent resistant & ideal for PEEK and similar substrates
118-06(SP)	B-stageable conductive adhesive.
125-22	B-stageable conductive adhesive with low flow & low CTE
125-22C119-44	Lower temperature curing version of 125-22
124-33(S)	Extremely flexible conductive adhesive
118-06(SD)	B-Stageable conductive adhesive
127-49A/B	Two part, room temperature curing silicone conductive adhesive
118-15A/B	Two part, long pot life, general purpose conductive adhesive. Available as one component
805-19C	One component room temperature curing
128-17A/B	Fast curing, room temperature curing conductive adhesive
GPC-251A/B	Two part, room temperature curing conductive adhesive
GPC -251A/CA-414	Two part, room temperature curing conductive adhesive
122-38(SD)	Ionically clean die attach adhesive
GPC-251A/B2612	Two part, room temperature, flexible conductive adhesive
124-08A/B	Two part, long pot life, flexible conductive adhesive
102-32NFC	High temperature, flexible silicone adhesive, non-flammable
102-32	High temperature, flexible silicone adhesive.
102-32RT	High temperature, flexible silicone adhesive, low temperature curing
126-40	Flexible fine feature epoxy adhesive
124-08LVC	Single component conductive adhesive.
128-33	High temperature single component conductive adhesive
125-19FS/B-507	Elastomeric silicone conductive ink
125-19(SP)A/B	Elastomeric silicone conductive ink, non-flammable
120-07LPS	Flexible/elastomeric conductive ink ideal for urethane substrates
126-03/B-507	Elastomeric carbon silicone resistive ink
126-03(SP)A/B	Elastomeric carbon silicone resistive ink, non-flammable
127-14	Elastomeric dielectric ink
126-26	Elastomeric silicone dielectric ink
126-08	Extremely high thermally conductive epoxy adhesive
122-07(SP)	Highly thermally conductive epoxy adhesive, B-Stageable
125-31FPC	Highly thermally conductive epoxy adhesive, B-Stageable, low temperature curing
127-03	Highly thermally conductive epoxy adhesive, B-Stageable
109-12	Low stress, high thermally conductive adhesive/potting compound
125-35C	Highly thermally conductive epoxy adhesive
127-31	Elastomeric, flexible thermally conductive adhesive/potting compound
116-04C	Highly thermally conductive epoxy adhesive/potting compound
122-39(SD)	Ionically clean die attach adhesive
108-50	Low stress, moderate thermally conductive adhesive/potting compound
108-50MG	Microelectronics grade, low stress, moderate thermally conductive adhesive/potting compound
813-04	One component thermally conductive semi-flexible epoxy
128-21C	Low stress thermally highly thermally conductive epoxy adhesive
125-35A/B	Highly thermally conductive epoxy adhesive
125-31A/B	Highly thermally conductive epoxy adhesive, higher viscosity version of 125-35A/B
116-04A/B-187	Highly thermally conductive epoxy adhesive/potting compound
810-44-2A/B	Highly thermally conductive epoxy adhesive
122-24A/B119-44	Highly thermally conductive low stress underfill adhesive
122-31A/B119-44	Highly thermally conductive low stress underfill adhesive, higher thixotropic version of 122-44
102-12A/B	Highly thermally conductive, thermal-cycle resistant black epoxy compound
116-03A/B-187	Thermally conductive epoxy adhesive/potting compound
122-38A/B-187	Thermally conductive epoxy potting compound
128-26	Thermally conductive silicone adhesive and encapsulant
904-64	Thermally conductive, addition cured silicone potting compound/adhesive
124-41	High temperature thermally conductive adhesive
126-41	High temperature, flame resistant thermally conductive adhesive
128-04	High temperature microelectronics grade thermally conductive adhesive
124-41(UT)	Ultra high temperature thermally conductive adhesive
124-19A/B	Room temperature curing, high bond strength
124-19A/B2713	Room temperature curing, high bond strength, increased flexibility
124-19C119-44	Low temperature curing, high bond strength
126-37	B-stageable conductive adhesive with low flow & low CTE
112-05	Thermoplastic urethane adhesive
126-22	Solvent resistant epoxy adhesive, ideal for LED bonding
127-41-25	UV curable pressure sensitive adhesive, ideal for 25µm bond line
127-41-50	UV curable pressure sensitive adhesive, ideal for 50µm bond line
127-45	Die attach adhesive
125-01A/B-187	Snap cure die attach adhesive
128-32FP	Fine pitch, B-Stageable epoxy adhesive
128-32-25	B-stageable epoxy adhesive, ideal for 25µm bond line
128-32-50	B-stageable epoxy adhesive, ideal for 50µm bond line
122-44	Silicone, pressure sensitive adhesive
122-44(SP)C	Non-flammable silicone, pressure sensitive adhesive
124-24	UV curable flexible adhesive
124-22C	Solvent resistant, low temperature curing epoxy adhesive
121-23	B-stageable conductive epoxy adhesive, ideal for In Mold Electronics connections with adhesion to polycarbonate
125-22-F	B-Stageable electrically conductive epoxy adhesive film
124-33-F	B-Stageable electrically conductive thermoplastic adhesive film
118-06-F	B-Stageable die attach electrically conductive epoxy adhesive film
126-37-F	B-Stageable anisotropic electrically conductive epoxy adhesive film
127-03-F	B-Stageable thermally conductive epoxy adhesive film
126-22-F	B-Stageable anisotropic electrically conductive urethane adhesive film
124-07-F	B-Stageable electrically insulating epoxy adhesive film
122-07-F	B-Stageable thermally conductive epoxy adhesive film
114-26B	Ag/AgCl conductive polymer coated film
114-26A	Ag/AgCl conductive polymer coated film
129-05	Ag/AgCl conductive polymer coated film
129-08	Silver/Carbon/Ag/AgCl polymer coated film
125-20	Chemically resistant electrode ink
126-49(SP)A/B	Elastomeric electrode ink for reference electrodes
117-43	Water-borne electrode ink
117-43(EU)	Water-borne electrode ink, NMP free
113-09	Standard electrode ink for defibrillation and reference electrodes
113-09(LPS)	More flexible, solvent resistant version of 113-09
113-09(S)	Increased solvent resistant version of 113-09
113-09H	Hydrophilic version of 113-09
117-23	Standard electrode ink for defibrillation electrodes
117-23(S)	Increased solvent resistant version of 117-23
124-36	Standard electrode ink
125-21	Chemically resistant electrode ink
106-12	Standard electrode material for ECG
119-10	Electrode ink
128-06(PP)	Electrode ink
127-11	Electrode ink for ECG electrodes
115-02	Electrode ink for ECG electrodes
F940A/B	Black, flame-out, epoxy potting and encapsulating compound. Low viscosity, self de-aerating, thermally conductive. Room temperature cure.
F940A/B-187	Low viscosity with long pot life. Requires mild heat cure.
F947A/B	Room temperature, improved heat resistance. Other properties similar to F940A/B.
F947A/B-187	Excellent heat resistance, extended pot life. Requires mild heat cure.
102-11A/B	Crack resistant, black, flame-out, epoxy compound. Room temperature cure, improved resistance to thermal cycling. Other properties similar to F947A/B.
102-11A/B-187	Excellent resistance to thermal shock, longer pot life. Requires mild heat cure.
102-12A/B-187	Same as above, but extended pot life; better resistance to thermal cracking.
113-33A/B	Crack resistant, black, flame-out, glob top epoxy. Non sag encapsulant.
904-64A/B	Two component, easy air release and low shrinkage addition cured silicone potting compound
811-64A/B	Two component, high performance, exhibits exceptional wetting and void free during pouring, with low shrinkage
128-13LVA/B	Room temperature curing silicone encapsulant & sealant
116-20	UV flexible curable encapsulant
128-16A/B	Room temperature curing urethane adhesive and sealant
128-27	Low stress thermally conductive epoxy cationic cured encapsulant
124-15	Green flame out epoxy
128-15	UV curable pressure sensitive adhesive
124-07	B-Stageable laminating adhesive
128-19	B-Stageable low CTE laminating adhesive
128-29	UV curable pressure sensitive adhesive
128-38	B-Stageable hermetic lid attach
127-04	B-Stageable laminating adhesive
129-03	B-Stageable Hybrid cure adhesive
102-32G1	Flexible conductive adhesive, lower resistivity version of 102-32
102-32D	Flexible conductive adhesive. Easier to dispense version of 102-32
125-19FS	Elastomeric silicone conductive ink,
904-64-4	Thermally conductive adhesive
105-48	Semi-conductive pressure-sensitive adhesive
117-33	High-temperature flexible conductive adhesive
127-49	Ultra high temperature conductive ink
127-38	Chemically and abrasion resistant conductive ink
127-39	Chemically and abrasion resistant conductive ink
908-61	Two component gray thermally conductive silicone
126-14	Low temperature curing adhesive
118-34	B-Stageable, electrically conductive epoxy adhesive with high reflow properties
124-08C	Single component version of 124-08A/B
GPC-251A/CA-414	Higher bond strength & lower viscosity version of GPC-251A/B
122-07	Highly thermally conductive epoxy adhesive, B-Stageable
126-32R	Red Jettable epoxy surface mount adhesive
126-32B	Blue Jettable epoxy surface mount adhesive
126-32Bk	Black Jettable epoxy surface mount adhesive
107-02	Reworkable, Environmentally friendly with an odorless solvent. Maintains flexibility at very low temperatures.
119-12	Useful in applications where a delay between the application of the adhesive and the final bonding of parts is desired
119-05	Prior to curing is designed to remain in a liquid state for up to 5 days without drying out. Excellent bonding to rigid circuitry.
120-02	Flexible, Medium Viscosity Electrically Conductive Adhesive
110-16	Flexible, Low Viscosity Electrically Conductive Adhesive
124-07HV	Higher viscosity version of 124-07
122-47	Die attach polyimide electrically conductive adhesive
Electraset 620	Die Attach grade conductive epoxy/adhesive for high throughput applications
Electraset 620-2	Die Attach grade conductive epoxy/adhesive with excellent thermal cycle properties
Electraset 620-3	Die Attach grade conductive epoxy/adhesive with highest thermal conductivity
Electraset 620-4	Die Attach grade conductive epoxy/adhesive with no bleed on gold contacts
127-12	Die attach grade thermally conductive epoxy adhesive
127-15(SD)	Thermally conductive flexible die attach epoxy adhesive
110-16(P)	Electrically conductive coating for tantalum capacitors and ceramic surfaces
123-36	Electrically conductive coating
125-24	Sprayable, room temperature curing coating coating for use on plastic housings.
126-43	Solvent resistant electrically conductive ink
128-22	Solvent resistant electrically conductive ink that spontaneously self nucleates.
110-16i	Solvent resistant electrically conductive ink that spontaneously self nucleates.
116-48	Higher viscosity version of 110-16i
115-28	Higher viscosity version of 116-48
117-31i	Solvent resistant electrically conductive ink that spontaneously self nucleates.
121-21	Solvent resistant electrically conductive ink that spontaneously self nucleates.
121-25	Electrically conductive ink/coating
127-16	Electrically conductive ink/coating
102-05F	Electrically conductive, flexible ink for use on Kapton® (polyimide) and Mylar® (polyester) flex circuits
117-48	Electrically conductive modified epoxy/ink for printing narrow lines onto three dimensional and flat surfaces
118-29	Waterborne electrically conductive coating for Low V.O.C. applications.
124-47	Electrically conductive silicone ink for use on hard to stick to surfaces
GPC-251 A/B	Two-part room temperature curing silver filled epoxy adhesive. This system is designed to be used for making electrical and mechanical attachments on electrical components and devices.
GPC-352-1A/B-187	Low Temperature, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.
GPC-352-1A/B119-44	Long pot life, two-part heat curing silver filled epoxy adhesive. Unlike typical heat curing systems this product always results in excellent conductivity and is less sensitive to handling and ambient conditions.
121-20A/B	Two-component low temperature curing silver filled epoxy adhesive exhibiting conductive only in the z-axis.
120-27A/B-187	Black low viscosity two-component underfill, epoxy potting and encapsulating compound. This product is designed to release entrapped air rapidly during cure, resulting in a smooth, pinhole-free surface
123-38A/B-187	Low-viscosity two component under fill potting and encapsulating compound. Shrinkage during cure has been optimized for use with GPC251A/B to provide good connections and to maintain them during temperature cycling. This product is designed for applications requiring very good thermal conductivity.
127-01A/B119-44	Electrically conductive epoxy/ink for bus-bar and traces, ideal for polycarbonate substrates
125-13HV	Fine line printable, 3 to 4 mil widths and spaces, high viscosity
108-06	UV curable conductive ink
124-50	Resistive conductive ink ideal for urethane and polycarbonate substrates
127-24PG	Highly flexible green dielectric.
124-33	Extremely flexible conductive adhesive
118-09C	Ready to print, precatalyzed and frozen version of 118-09A/B119-44
128-18A/B119-44	Fine line solvent resistant low temperature curing, flexible conductive epoxy ink for ITO/TCO coated substrates
120-07	Fast curing, thermoplastic conductive ink for ITO/TCO coated substrates
129-15	Electrically conductive ink suitable for OPV modules
GPC 251A/B	Two part, room temperature curing conductive adhesive
122-30	Ceramic filled thermoplastic adhesive suitable for low energy substrates with spacer beads
117-38	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device
118-26	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device
118-27	One component. Flame Resistant. Useful as a solder resistant coating for electrical and electronic device
117-49	B-stageable, thermally conductive coating and adhesive
122-29	Low stress, thermally conductive epoxy adhesive
121-47	Electrically conductive/thermally conductive via filling paste.
127-48	Solvent resistant washable conductive ink
906-57A/B	Room temperature curing two component urethane encapsulant
128-39	Dielectric adhesive and coating
129-14(LR)	Low resistance fast curing epoxy ink, designed for polycarbonate substrates
129-14(MR)	Moderate resistance fast curing epoxy ink, designed for polycarbonate substrates
129-14(HR)	High resistance fast curing epoxy ink, designed for polycarbonate substrates
124-18	Translucent white, adheres ITO or and polycarbonate
118-38	Water-borne conductive ink
124-34A/B-187	Snap cure electrically conductive epoxy adhesive
114-34A/B	Electrically resistive ink ideal for ITO substrates
124-31	Translucent conductive ink
128-45	Flexible Phosphor ink
128-50LPW	Flexible Phosphor ink
128-50LPE	Flexible Phosphor ink
128-49	Dielectric ink
123-34	B-Stageable Epoxy Adhesive

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